Photosensitive conductive paste

A conductive paste, photosensitive technology, applied in the direction of conductive coating, conductive pattern formation, optics, etc., can solve the problems of increased resistance, poor storage stability of paste coating film, easy peeling, etc., to achieve good adhesion and preservation good stability effect

Active Publication Date: 2014-09-24
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, depending on the type of epoxy resin, there are problems such as poor storage stability of the paste-coated film, changes in the shape of the obtained conductive pattern depending on the time until exposure, or differences with resin films, glass, etc. The adhesiveness of the base material is not effective
[0005] In addition, by increasing the amount of epoxy resin, the initial adhesion becomes good, but there is a problem that it is easy to peel off after the heat and humidity test
In addition, when the amount of epoxy resin is increased, there is a problem that the resistance increases

Method used

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  • Photosensitive conductive paste
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0070] Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples. Materials and evaluation methods used in Examples and Comparative Examples are as follows.

[0071]

[0072] Coat the photosensitive conductive paste on the PET film in such a way that the dry thickness reaches 10 μm, and dry it in a drying oven at 90°C for 10 minutes. The arrayed linear group was used as one unit, exposed and developed through a photomask having nine types of units with different L / S values, and cured at 140° C. for 1 hour to obtain a conductive pattern. The L / S value of each cell was set to 50 / 50, 40 / 40, 30 / 30, 25 / 25, and 20 / 20 (line width (μm) / space (μm) respectively). The pattern was observed with an optical microscope, and a pattern having the minimum L / S value without residue and pattern peeling was confirmed between the patterns, and the minimum L / S value was defined as the developable L / S.

[0073]

[0074] Coat the...

Synthetic example 1

[0089] (Synthesis Example 1) Photosensitive Component (B-1)

[0090] Copolymer of ethyl acrylate (EA) / 2-ethylhexyl methacrylate (2-EHMA) / styrene (St) / acrylic acid (AA) (copolymerization ratio: 20 parts by weight / 40 parts by weight / 20 parts by weight parts / 15 parts by weight) addition reaction of 5 parts by weight of glycidyl methacrylate (GMA)

[0091] 150 g of diethylene glycol monoethyl ether acetate was put into the reaction container of nitrogen atmosphere, and it heated up to 80 degreeC using the oil bath. Spending 1 hour thereto, 20 g of ethyl acrylate, 40 g of 2-ethylhexyl methacrylate, 20 g of styrene, 15 g of acrylic acid, 0.8 g of 2,2'-azobisisobutyronitrile, and diethylene glycol mono A mixture of diethyl ether acetate 10 g. After completion of the dropwise addition, a polymerization reaction was further performed for 6 hours. Thereafter, 1 g of hydroquinone monomethyl ether was added to terminate the polymerization reaction. Next, a mixture containing 5 g of gl...

Synthetic example 2

[0092] (Synthesis Example 2) Photosensitive Component (B-2)

[0093] Copolymer of ethylene oxide-modified bisphenol A diacrylate FA-324A (product name, manufactured by Hitachi Chemical Industry Co., Ltd.) / EA / AA (copolymerization ratio: 50 parts by weight / 10 parts by weight / 15 parts by weight) Components obtained by addition reaction of 5 parts by weight of glycidyl methacrylate (GMA)

[0094] 150 g of diethylene glycol monoethyl ether acetate was put into the reaction container of nitrogen atmosphere, and it heated up to 80 degreeC using the oil bath. It took 1 hour to dropwise add 50 g of ethylene oxide-modified bisphenol A diacrylate FA-324A, 20 g of ethyl acrylate, 15 g of acrylic acid, 0.8 g of 2,2'-azobisisobutyronitrile, and diethylene diacrylate. Alcohol monoethyl ether acetate 10g mixture. After completion of the dropwise addition, a polymerization reaction was further performed for 6 hours. Thereafter, 1 g of hydroquinone monomethyl ether was added to terminate the...

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Abstract

The purpose of the present invention is to provide a photosensitive conductive paste which provides a coating film that has good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The present invention provides a photosensitive conductive paste, which contains (A) conductive particles, (B) a photosensitive component, (C) a photopolymerization initiator and (D) an epoxy resin, and wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.

Description

technical field [0001] The present invention relates to a photosensitive conductive paste for forming conductive patterns. Background technique [0002] The conductive pattern in the present invention refers to a conductive pattern containing both an organic component including a resin and an inorganic component including a conductive filler. [0003] Conventionally, in order to form the above-mentioned organic-inorganic composite conductive pattern, a so-called polymer type conductive paste in which a large amount of particulate silver powder, copper powder, or carbon particles is mixed with a resin or an adhesive has been put into practical use. In general, in order to form a conductive pattern, there are methods using screen printing (for example, refer to Patent Documents 1 and 2) and methods using photocurable photosensitive conductive curable pastes (for example, see Patent Document 3). Influenced by the trend of thinner lines and lower temperatures, the use of photoc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004H01B1/20H01B1/22H05K3/12
CPCC09D11/00C09D11/52H05K2203/0514C09D11/101H05K3/02G03F7/168G03F7/004H01B1/22C09D5/24H05K1/095G03F7/0047G03F7/038G03F7/0388
Inventor 松叶聪水口创草野一孝
Owner TORAY IND INC
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