Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same

Abstract

The invention provides a sheet-shaped epoxy resin composition for encapsulating electronic components and an electronic component device using the same, wherein the storage stability is good, and the gas output during the solidification can be reduced. The composition is the sheet-shaped epoxy resin composition for encapsulating the electronic components, and the thickness of the sheet is in a range from 150(mu)m to 1mm. the epoxy resin composition comprises the following (A) to (D) composition, and the following (E)composition. (A) is the epoxy resin, (B) is the phenolic resin, (C) is the elastomer, (D) is the inorganic filler. The (E) is at least one of the following 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(1), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(2), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(3).

Description

technical field [0001] The present invention relates to an epoxy resin composition for encapsulating a chip-shaped electronic component, which can reduce the generation of outgassing during curing and has excellent room-temperature storage stability, and an electronic component device using the same. Background technique [0002] Conventionally, electronic components (electronic devices) represented by various semiconductor elements have been resin-encapsulated and deviceized using a thermosetting resin composition containing epoxy resin as a main component. The above-mentioned thermosetting resin composition usually contains a curing accelerator, and by using the curing accelerator, the thermosetting reaction can be smoothly advanced in a short time. However, as a result of using the above-mentioned curing accelerator, both preservation properties become a problem. Therefore, thermosetting resin compositions usually need to be stored by refrigeration or freezing, and this ...

AI Technical Summary

Problems solved by technology

However, it is known that these phosphonium borate-based curing accelerators decompose during the reaction to generate outgassing, and the outgassing components generated may cause voids in molded products, and these outgassing components may adhere to electronic devices. surface of the component, therefore, in some electronic equipment, there are concerns about adverse effects on its characteristics

[0004] Especially in the case of an epoxy resin composition sheet for encapsulation made by coating a varnish for forming the sheet, since the raw material needs to be temporarily made into a varnish state, the pot life of the epoxy resin composition sheet is limited. Great impact

From the viewpoint of the pot life, tetraphenylphosphonium tetraphenylborate can be used, but there is a concern that outgassing may adversely affect device performance (refer to Patent Document 4)

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