Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same
A technology of epoxy resin and electronic components, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., and can solve the adverse effects of characteristics, adverse effects of equipment performance, and the large impact of epoxy resin composition tablets on the shelf life and other problems, to achieve the effect of reducing warpage, good storage stability, and excellent storage stability
A technology of epoxy resin and electronic components, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., and can solve the adverse effects of characteristics, adverse effects of equipment performance, and the large impact of epoxy resin composition tablets on the shelf life and other problems, to achieve the effect of reducing warpage, good storage stability, and excellent storage stability
CN103160076AInactive Publication Date: 2013-06-19NITTO DENKO CORP
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Embodiment 1~10
[0122] Embodiment 1~10, comparative example 1~6
[0123] Preparation of sheet-like epoxy resin composition
[0124] The components shown in Tables 1 to 2 described later were dispersed and mixed at the ratios shown in the tables, and methyl ethyl ketone in the same amount as the total amount of the components was added thereto to prepare a coating varnish.
[0125] Next, the above-mentioned varnish was coated on the release-treated surface of a polyester film (manufactured by Mitsubishi Plastics Corporation, MRF-38) with a thickness of 38 μm using a comma coater, and dried to form a sheet-shaped ring with a thickness of 50 μm. A resin layer formed of an oxygen resin composition.
[0126] Next, the peeling-processed surface of the polyester film prepared separately was bonded to the said resin layer (sheet-shaped epoxy resin composition), and it wound up. Then, while peeling off the polyester film appropriately, 12 sheets of the above-mentioned sheet-like epoxy resin comp...
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Abstract
The invention provides a sheet-shaped epoxy resin composition for encapsulating electronic components and an electronic component device using the same, wherein the storage stability is good, and the gas output during the solidification can be reduced. The composition is the sheet-shaped epoxy resin composition for encapsulating the electronic components, and the thickness of the sheet is in a range from 150(mu)m to 1mm. the epoxy resin composition comprises the following (A) to (D) composition, and the following (E)composition. (A) is the epoxy resin, (B) is the phenolic resin, (C) is the elastomer, (D) is the inorganic filler. The (E) is at least one of the following 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(1), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(2), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(3).
Description
technical field [0001] The present invention relates to an epoxy resin composition for encapsulating a chip-shaped electronic component, which can reduce the generation of outgassing during curing and has excellent room-temperature storage stability, and an electronic component device using the same. Background technique [0002] Conventionally, electronic components (electronic devices) represented by various semiconductor elements have been resin-encapsulated and deviceized using a thermosetting resin composition containing epoxy resin as a main component. The above-mentioned thermosetting resin composition usually contains a curing accelerator, and by using the curing accelerator, the thermosetting reaction can be smoothly advanced in a short time. However, as a result of using the above-mentioned curing accelerator, both preservation properties become a problem. Therefore, thermosetting resin compositions usually need to be stored by refrigeration or freezing, and this ...
Claims
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Patent Timeline
19 Jun 2013
Publication
CN103160076A
- IPC
- C08L63/00; C08L61/06; C08K3/00; C08K5/3445; C08K5/32; H01L23/29
- Inventors
- 丰田英志; 石坂刚