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PHotosensitive Resin Composition, Protective Film Or Insulation Film Obtained By Heat Curing Said Composition, Touch Panel Using Said Film, And Production Method For Said Touch Panel

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of substrate adhesion reduction, material deterioration, etc., and achieve no reduction in adhesion, excellent vacuum resistance, and good storage stability Effect

Inactive Publication Date: 2015-10-14
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, a cured film obtained from a photosensitive transparent material is exposed to a high vacuum state during the film formation of ITO. If the resistance to vacuum is low, the cured film will deteriorate due to outgassing from the cured film, and become a bond with the substrate. Causes of Adhesion Decrease
[0005] Furthermore, if the coating liquid of the photosensitive transparent material is stored at room temperature, there is also a problem that the material deteriorates during storage and the adhesion to the substrate decreases.

Method used

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  • PHotosensitive Resin Composition, Protective Film Or Insulation Film Obtained By Heat Curing Said Composition, Touch Panel Using Said Film, And Production Method For Said Touch Panel
  • PHotosensitive Resin Composition, Protective Film Or Insulation Film Obtained By Heat Curing Said Composition, Touch Panel Using Said Film, And Production Method For Said Touch Panel
  • PHotosensitive Resin Composition, Protective Film Or Insulation Film Obtained By Heat Curing Said Composition, Touch Panel Using Said Film, And Production Method For Said Touch Panel

Examples

Experimental program
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Effect test

Embodiment

[0156] The present invention will be described more concretely below with examples and comparative examples, but the present invention is not limited to these ranges. In addition, when abbreviated symbols are used for the compounds used, the names are shown below.

[0157] AcOH: acetic acid

[0158] Al-A: Aluminum chelate A (manufactured by Fain Chemical Co., Ltd.; tris(acetylacetonate)aluminum(III))

[0159] BAPF: 9,9-bis[4-(3-acryloyloxypropoxy)phenyl]fluorene

[0160] BDG: butanediol, diethylene glycol mono-n-butyl ether

[0161] BGPP: 2,2-bis(4-glycidoxyphenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0162] BMI-70: 3,3'-diethyl-5,5'-dimethyl-4,4'-bis(maleimide)diphenylmethane (manufactured by KI Kasei Co., Ltd.)

[0163] BMI-80: 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane (manufactured by KI Kasei Co., Ltd.)

[0164] BPEF: 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene (manufactured by Osaka Gas Chemical Co., Ltd.)

[0165] BYK-333: Silicone-based s...

Synthetic example 1

[0205] Synthesis of Synthesis Example 1 Acrylic Resin Solution (A-1)

[0206] 0.821 g (1 mol%) of 2,2'-azobis(isobutyronitrile) and 29.09 g of PGMEA were placed in the flask, and after the inside of the flask was sufficiently replaced with nitrogen by bubbling, the temperature was raised to 80°C. Then, add dropwise over 4 hours the mixed solution of N-cyclohexylmaleimide 26.88g (30mol%), methacrylic acid 19.37g (45mol%), methyl methacrylate 12.52g (25mol%), at 80 It was heated and stirred at ℃ for 6 hours. Next, 14.22 g (20 mol%) of glycidyl methacrylate, 0.676 g (1 mol%) of dimethylbenzylamine, 0.186 g (0.3 mol%) of 4-methoxyphenol, PGMEA59 .06 g, heated and stirred at 70° C. for 2 hours to obtain an acrylic resin solution (A-1). PGMEA was added to the obtained acrylic resin solution (A-1) so that the solid content concentration would be 35% by weight. The weight average molecular weight (Mw) of the acrylic resin was 11000, the acid value was 100, and the double bond equiv...

Synthetic example 2

[0207] Synthesis example 2 Synthesis of acrylic resin solution (A-2)

[0208] 0.821 g (1 mol%) of 2,2'-azobis(isobutyronitrile), 26.15 g of PGMEA, 13.44 g (15 mol%) of N-cyclohexylmaleimide, and 19.37 g (45 mol%) of methacrylic acid were used , methyl methacrylate 20.02g (40mol%), glycidyl methacrylate 14.22g (20mol%), dimethylbenzylamine 0.676g (1mol%), 4-methoxyphenol 0.186g (0.3 mol%), PGMEA 53.10g, and polymerized in the same manner as in Synthesis Example 1 to obtain an acrylic resin solution (A-2). PGMEA was added to the obtained acrylic resin solution (A-2) so that the solid content concentration would be 35% by weight. The weight average molecular weight (Mw) of the acrylic resin was 15,000, the acid value was 109, and the double bond equivalent was 670.

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Abstract

The purpose of the present invention is to provide an alkali developable photosensitive resin composition which exhibits excellent coating-liquid storage stability and no reduction in adhesive properties during storage, and with which a cured film exhibiting a high hardness, and excellent transparency, moist-heat resistance, synthetic sweat resistance, adhesive properties, chemical resistance, and vacuum resistance, can be produced. Accordingly, provided is a photosensitive resin composition which includes an acrylic resin (A), a radically polymerizable compound (B), a photopolymerization initiator (C), a metal chelate compound (D), and a solvent (E), said acrylic resin (A) having a structure derived from a maleimide having a specific structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a thermally cured protective film or insulating film, a touch panel using the same, and a method for producing the same. Background technique [0002] In recent years, with the popularization of smart phones and tablet terminals, capacitive touch panels have attracted attention. The sensor substrate of a capacitive touch panel generally has ITO (Indium Tin Oxide, indium tin oxide) or metal (silver, molybdenum, aluminum, etc.) patterned wiring on glass, and the intersection of wiring is A structure having an insulating film and a protective film for protecting ITO and metal is common. In most cases, the protective film is made of inorganic SiO with high hardness. 2 or SiN x or a photosensitive transparent material (Patent Document 1), and the insulating film is formed of a photosensitive transparent material. However, inorganic materials have the following problems: due to the use ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038G03F7/004G03F7/027G03F7/075
CPCG03F7/027G03F7/0047G03F7/033G03F7/038
Inventor 谷垣勇刚藤原健典诹访充史福原将
Owner TORAY IND INC
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