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Single-component epoxy heat-conducting adhesive

A thermally conductive adhesive, one-component technology, applied in the direction of in-line phenolic epoxy resin adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problem that the surface treatment of thermally conductive fillers is not listed in relevant patents mentioned and other issues, to achieve good storage stability, reduce usage, and meet the effects of thermally conductive packaging and bonding

Active Publication Date: 2012-09-12
JIAOZUO ZHUOLI STAMPING MATERIAL CO., LTD.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are few reports at home and abroad in this regard, and the surface treatment of thermally conductive fillers has not been mentioned in relevant patents.

Method used

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  • Single-component epoxy heat-conducting adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1 Preparation of thermally conductive filler A

[0018] Raw materials are prepared according to the following weight percentages: nano-silicon carbide (thermally conductive filler) 10%, lauric acid (organic acid) 0.5% and γ-aminopropyltriethoxysilane (coupling agent) 0.5%, and the balance is acetic acid ethyl ester (solvent).

[0019] Take lauric acid and dissolve it in ethyl acetate with slight heat, add nano-silicon carbide powder to grind and disperse, add γ-aminopropyltriethoxysilane after the grinding is complete, continue to stir for a period of time until uniform, and then vacuum at 75°C In a rake-type vacuum dryer with a temperature of 0.85Mpa, the ethyl acetate is completely volatilized, the solvent is condensed and recycled for use, and the powder is collected for later use.

Embodiment 2

[0020] Example 2 Preparation of thermally conductive filler B

[0021] Raw materials are prepared according to the following weight percentages: nano-aluminum nitride (thermally conductive filler) 13%, stearic acid (organic acid) 0.8% and γ-aminopropyltriethoxysilane (coupling agent) 0.2%, the balance For methanol (solvent).

[0022] Take stearic acid and dissolve it in methanol slightly, add nano-aluminum nitride powder to grind and disperse, add γ-aminopropyltriethoxysilane after the grinding is complete, continue to stir for a period of time until uniform, and then vacuum at 70°C The temperature is 0.8Mpa in a rake-type vacuum dryer to completely volatilize the methanol, the solvent is condensed and recycled, and the powder is collected for later use.

Embodiment 3

[0023] Example 3 Preparation of thermally conductive filler C

[0024] Raw materials are prepared according to the following weight percentages: 17% of nano-alumina (thermally conductive filler), 2% of lauric acid (organic acid) and 1% of monoalkoxy pyrophosphate titanate (coupling agent), and the balance is acetone ( solvent).

[0025] Take lauric acid and dissolve it in acetone with slight heat, add nano-alumina powder for grinding and dispersing, add monoalkoxy pyrophosphate titanate after grinding, continue stirring for a period of time until uniform, and then vacuum at 75°C to 0.85Mpa In the lower rake vacuum dryer, the acetone is completely volatilized, the solvent is condensed and recycled, and the powder is collected for later use.

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Abstract

The invention discloses a single-component epoxy heat-conducting adhesive which consists of the following components in percentage by weight: 20 to 60 percent of epoxy resin, 5 to 15 percent of diluent, 5 to 25 percent of curing agent and 20 to 50 percent of heat-conducting filler, wherein the heat-conducting filler is prepared by performing surface treatment in the following method: adding the heat-conducting filler, organic acid and a coupling agent into solvent and uniformly dispersing, drying until the solvent is completely volatilized, and collecting the obtained powder for later use, thereby finishing the whole treatment process; and the raw materials comprise the following components in percentage by weight: 10 to 20 percent of heat-conducting filler, 0.5 to 5 percent of organic acid, 0.2 to 2 percent of coupling agent, and the balance of solvent. The heat-conducting filler is subjected to surface treatment, the epoxy resin serves as a matrix, the highly heat-conducting adhesive is prepared and has high preservation stability, and the usage amount of the heat-conducting filler is reduced; and moreover, the solvent is recycled in the production process, and the environmental pollution is slight, so that the single-component epoxy heat-conducting adhesive has the advantages of convenience in use, excellent performance and low cost, and the requirements of heat-conducting package and adhesion in the fields of electronics and electrics and the like are well met.

Description

technical field [0001] The invention belongs to the field of heat transfer between one or more electronic devices such as bonding of electronic devices, thermal interface materials of electronic devices, sealing of electronic devices, etc., and specifically relates to a one-component epoxy thermally conductive adhesive. Background technique [0002] With the rapid development of integrated circuits and assembly technologies, high thermal conductivity materials are urgently needed in many occasions. Most metal materials dissipate heat faster and can meet the heat conduction requirements to a certain extent. However, metal materials have the disadvantages of large specific gravity, electrical conductivity, corrosion resistance, and poor adaptability to different shapes of heat conduction interfaces, which limit their application in specific fields. . In recent years, people have gradually developed thermal conductive adhesives, coatings, and potting materials based on epoxy r...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04C09J11/06
Inventor 刘海军常海峰陈小年张军涛杨希玲耿艳萍王蓬勃
Owner JIAOZUO ZHUOLI STAMPING MATERIAL CO., LTD.
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