Polyimide precursor and resin composition containing same

A technology of polyimide precursor and diaminobenzanilide, which is applied in the field of polyimide precursor and resin composition containing it, can solve the problem that it is difficult to use in fields requiring transparency, low transmittance, etc. problems, to achieve the effect of excellent storage stability, high elongation, and excellent transparency

Active Publication Date: 2016-08-31
ASAHI KASEI KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, polyimide resin is colored brown or yellow due to its high aromatic ring density, and has

Method used

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  • Polyimide precursor and resin composition containing same
  • Polyimide precursor and resin composition containing same
  • Polyimide precursor and resin composition containing same

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0158] The solution can be directly used for the preparation of the resin composition, or

[0159] The polyimide precursor contained in the solution may be isolated and purified, and then used for the preparation of the resin composition.

[0160]

[0161] The resin composition of this embodiment contains the polyimide precursor and the solvent as mentioned above, and may contain other additives as needed.

[0162] Examples of such other additives include alkoxysilane compounds, surfactants, and leveling agents.

[0163] (Alkoxysilane compound)

[0164] When forming an element such as TFT from the polyimide obtained from the resin composition of this embodiment, in order to maintain sufficient adhesion between the polyimide and the support, the resin composition may contain 100% by mass of the polyimide precursor. 0.001 to 2% by mass of alkoxysilane compound.

[0165] When the content of the alkoxysilane compound with respect to 100% by mass of the polyimide precursor is 0.01% by mass o...

Example Embodiment

[0216] Example

[0217] Hereinafter, the present invention will be specifically described based on examples. These are described for illustration, and the scope of the present invention is not limited to the following examples.

[0218] The various evaluations in the examples and comparative examples are as follows.

[0219] (Determination of weight average molecular weight)

[0220] The weight average molecular weight is measured using gel permeation chromatography (GPC) under the following conditions. The standard curve for calculating the weight average molecular weight was prepared using standard polystyrene (manufactured by Tosoh Corporation).

[0221] Solvent: N,N-dimethylformamide (manufactured by Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography) was used, and 24.8 mmol / L lithium bromide monohydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was added immediately before the measurement. , Purity 99.5%) and 63.2mmol / L phosphoric acid (m...

Example Embodiment

[0283] [Reference example 1]

[0284] In a nitrogen atmosphere, add 15.69g (49.00mmol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB) and 178.95g of N-methyl-2-pyrrolidone (NMP) to a 500ml separable flask , Dissolve TFMB under stirring. Thereafter, 1.09 g (5.0 mmol) of pyromellitic dianhydride (PMDA), 3.10 g (10.0 mmol) of 4,4'-oxobisphthalic dianhydride (ODPA), and 1,2,3, 6.86 g (35.0 mmol) of 4-cyclobutanetetracarboxylic dianhydride (CBDA) was stirred at 80°C for 4 hours to obtain an NMP solution of polyamic acid (hereinafter also referred to as "varnish"). The weight average molecular weight (Mw) of the obtained polyamic acid was 116,500. The CTE, YI value, and elongation of the film cured at 330°C are shown in Table 2 below.

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Abstract

A polyimide precursor characterized by having a structure derived from 2,2'-bis(trifluoromethyl)benzidine (TFMB) or the like as a diamine-derived structure and also having both a structure derived from a specific alicyclic tetracarboxylic acid dianhydride and a structure derived from an aromatic tetracarboxylic acid dianhydride as structures each derived from a tetracarboxylic acid dianhydride, wherein the degree of imidation of an amide bond derived from the alicyclic tetracarboxylic acid dianhydride is 10 to 100%.

Description

technical field [0001] The present invention relates to a polyimide precursor and a resin composition containing the same. This polyimide precursor can be used, for example, as a substrate for a flexible device. [0002] The present invention also provides a polyimide film, a method for producing the same, a laminate, and a method for producing the same. Background technique [0003] A polyimide film is generally a film formed of polyimide resin. Polyimide resin is a highly heat-resistant polyimide resin produced by solution polymerization of aromatic tetracarboxylic dianhydride and aromatic diamine to produce a polyimide precursor, followed by thermal imidization or chemical imidization. resin. The aforementioned thermal imidization is performed by ring-closing dehydration at high temperature, and the aforementioned chemical imidation is performed by ring-closing dehydration using a catalyst. [0004] Polyimide resin is an insoluble and infusible super heat-resistant re...

Claims

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Application Information

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IPC IPC(8): C08G73/10B32B27/34C08J5/18
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08C08G73/10C08G73/1028
Inventor 宫本佳季米谷昌树饭塚康史金田隆行奥田敏章
Owner ASAHI KASEI KOGYO KK
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