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Polyimide precursor and resin composition containing same

A technology of polyimide precursor and diaminobenzanilide, which is applied in the field of polyimide precursor and resin composition containing it, can solve the problem that it is difficult to use in fields requiring transparency, low transmittance, etc. problems, to achieve the effect of excellent storage stability, high elongation, and excellent transparency

Active Publication Date: 2016-08-31
ASAHI KASEI KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, polyimide resin is colored brown or yellow due to its high aromatic ring density, and has low transmittance in the visible light region, so it is difficult to use in fields requiring transparency

Method used

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  • Polyimide precursor and resin composition containing same
  • Polyimide precursor and resin composition containing same
  • Polyimide precursor and resin composition containing same

Examples

Experimental program
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preparation example Construction

[0158] The solution can be directly used for the preparation of the resin composition, or

[0159] The polyimide precursor contained in this solution may be used for preparation of a resin composition after isolation|separation and purification.

[0160]

[0161] The resin composition of this embodiment contains the above-mentioned polyimide precursor and a solvent, and may contain other additives as needed.

[0162] As such other additives, an alkoxysilane compound, surfactant, a leveling agent, etc. are mentioned, for example.

[0163] (alkoxysilane compound)

[0164] When the polyimide obtained from the resin composition of this embodiment is used as an element such as a TFT, in order to maintain sufficient adhesion between the resin composition and the support, the resin composition may contain 0.001 to 2% by mass of an alkoxysilane compound.

[0165] When content of an alkoxysilane compound is 0.01 mass % or more with respect to 100 mass % of polyimide precursors, it...

Embodiment

[0217] Hereinafter, the present invention will be specifically described based on examples. These are described for explanation, and the scope of the present invention is not limited to the following examples.

[0218] Various evaluations in Examples and Comparative Examples are as follows.

[0219] (Determination of weight average molecular weight)

[0220] The weight average molecular weight is measured under the following conditions using gel permeation chromatography (GPC). A calibration curve for calculating the weight average molecular weight was prepared using standard polystyrene (manufactured by Tosoh Corporation).

[0221] Solvent: N,N-dimethylformamide (manufactured by Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography) was used, and 24.8 mmol / L of lithium bromide monohydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was added immediately before measurement , purity 99.5%) and phosphoric acid of 63.2 mmol / L (manufactured b...

reference example 1

[0284] Under a nitrogen atmosphere, 15.69 g (49.00 mmol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB) and 178.95 g of N-methyl-2-pyrrolidone (NMP) were added to a 500 ml separable flask , dissolve TFMB under stirring. Thereafter, 1.09 g (5.0 mmol) of pyromellitic dianhydride (PMDA), 3.10 g (10.0 mmol) of 4,4'-oxodiphthalic dianhydride (ODPA) and 1,2,3, 6.86 g (35.0 mmol) of 4-cyclobutanetetracarboxylic dianhydrides (CBDA) were stirred at 80 degreeC for 4 hours, and the NMP solution (it is also called "varnish" hereafter.) of a polyamic acid was obtained. The weight average molecular weight (Mw) of the obtained polyamic acid was 116,500. The CTE, YI value, and elongation of the film cured at 330° C. are shown in Table 2 below.

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Abstract

A polyimide precursor characterized by having a structure derived from 2,2'-bis(trifluoromethyl)benzidine (TFMB) or the like as a diamine-derived structure and also having both a structure derived from a specific alicyclic tetracarboxylic acid dianhydride and a structure derived from an aromatic tetracarboxylic acid dianhydride as structures each derived from a tetracarboxylic acid dianhydride, wherein the degree of imidation of an amide bond derived from the alicyclic tetracarboxylic acid dianhydride is 10 to 100%.

Description

technical field [0001] The present invention relates to a polyimide precursor and a resin composition containing the same. This polyimide precursor can be used, for example, as a substrate for a flexible device. [0002] The present invention also provides a polyimide film, a method for producing the same, a laminate, and a method for producing the same. Background technique [0003] A polyimide film is generally a film formed of polyimide resin. Polyimide resin is a highly heat-resistant polyimide resin produced by solution polymerization of aromatic tetracarboxylic dianhydride and aromatic diamine to produce a polyimide precursor, followed by thermal imidization or chemical imidization. resin. The aforementioned thermal imidization is performed by ring-closing dehydration at high temperature, and the aforementioned chemical imidation is performed by ring-closing dehydration using a catalyst. [0004] Polyimide resin is an insoluble and infusible super heat-resistant re...

Claims

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Application Information

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IPC IPC(8): C08G73/10B32B27/34C08J5/18
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08C08G73/10C08G73/1028
Inventor 宫本佳季米谷昌树饭塚康史金田隆行奥田敏章
Owner ASAHI KASEI KOGYO KK
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