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Transfer film containing a layer with wale structure

A transfer film and embossed technology, applied in the field of multi-layer body, can solve the problems of no inspection, hidden risks, etc.

Inactive Publication Date: 2008-04-09
OVD KINEGRAM AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The coating method has the disadvantage that the coating result depends on the texture of the nanoparticles and the coating method
The disadvantage is that the application of the nanoparticles is set by the spray gun and that the nanoparticles can peel off the support layer after prolonged use
In addition, the toxic effect of the nanoparticles is hardly tested during manufacture, use and end-of-life, which hides the risk

Method used

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  • Transfer film containing a layer with wale structure
  • Transfer film containing a layer with wale structure
  • Transfer film containing a layer with wale structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] FIG. 1 shows a multilayer body 1 on a carrier 20 , which is composed of a transparent structured texture layer 14 and an adhesive layer 16 . The carrier 20 can be, for example, the front screen of a display.

[0063] The transparent structured texture layer 14 has a relief structure 14 o on its upper side facing away from the adhesive layer 16 . The relief structure 14 o can be, for example, a reflection-reducing relief structure, as described below in FIGS. 3 and 4 . The relief structure 14o can also be a dirt-resistant relief structure, which is described hereinafter in FIGS. 5a and 5b.

[0064] Furthermore, it can be provided that the relief structure 14 o is formed as a retroreflector. This can be a partial area in the form of a logo.

[0065] The relief structure 14o can also be defined by means of a structure texture for a relief display whose contour depth is limited to a predetermined value, similar to a Fresnel lens. A relief structure of this type interfer...

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PUM

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Abstract

Described is a transfer film, in particular a hot embossing film, which includes a carrier film and a transfer layer portion having a structure layer, the transfer layer portion being arranged on the carrier film and being detachable from the carrier film, wherein it is provided that the carrier film has a master relief structure on its side towards the structure layer and the structure layer on its side towards the carrier film has a relief structure complementary to the master relief structure of the carrier film. There is further provided a process for the production of the transfer film and a multi-layer body formed with the structure layer.

Description

technical field [0001] The invention relates to a transfer film, in particular a heat embossed film, and to a method for producing such a transfer film, as well as to a multilayer body. The transfer film comprises a support film and a transfer layer with a structured texture layer disposed on and detachable from the support film. Background technique [0002] The usability of technical objects can be improved through a rational surface structure, for example by designing surfaces with reduced reflections or dust protection. [0003] A method for producing self-cleaning metal surfaces is described in DE 19962641, however, the method is limited there to metal surfaces. [0004] DE 10233831A1 provides: a hardenable substrate is applied as a support layer to the surface to be protected by means of a coating process; nanoparticles are applied to the support layer by means of a coating process, and by hardening of the support layer Hold the particles in place. The coating metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/16B44C1/17B42D15/00G02B27/00
CPCB42D15/10B44C1/172B42D15/0013G02B5/1809B42D25/29B42D25/00B42D2033/24B44C1/16Y10T428/24851Y10T428/28Y10T428/24521Y10T428/2848Y10T428/24612Y10T428/2486B42D25/23B42D25/324
Inventor R·斯托布A·汉森J·阿特内尔
Owner OVD KINEGRAM AG