Big opening angle stack wafer transmitting transducer
A technology for transmitting transducers and chips, which is applied in the direction of sound-generating devices, instruments, and fluids using vibrations, etc. It can solve the problems of small beam width and reduce the working frequency of transducers, so as to increase the opening angle of the transmitting beam and improve the transmission efficiency. The effect of high sensitivity and emitted sound energy density
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[0038] The stacked wafer emitting transducer of the present invention will be described in detail below with reference to the accompanying drawings and examples.
[0039] The stacked wafer emission transducer of this example comprises piezoelectric wafer stack 2, front cover plate 1, backing 5, prestressed screw 6, waterproof sound-permeable layer 8 and output cable 7 etc., as Figure 6 shown.
[0040] In the piezoelectric wafer stack 2, the wafers are made of piezoelectric ceramic PZT with a hole in the center, and the polarization directions of every two adjacent wafers are opposite (see Figure 8 ). Between the chips, and between the chip and the front cover 1 and the backing 5, a thin metal sheet 3 is clamped to weld the leads 4. The wafer, the metal sheet 3, the front cover 1 and the backing 5 are glued together with epoxy resin. Die stack wiring such as Figure 8 As shown, a parallel connection is used to ensure that the same phase voltage is applied to each chip at ...
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