Cylindrical stack wafer underwater transducer

An underwater acoustic transducer, cylindrical technology, applied to the transducers, piezoelectric/electrostrictive transducers, sensors and other directions used underwater, can solve the problem of low sensitivity, achieve high sensitivity, make up for the sensitivity Small, high sound energy density effect

Inactive Publication Date: 2008-12-10
BEIJING INFORMATION SCI & TECH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Cylindrical and spherical transducers have simple structures, large beam directivity width (opening angle) (horizontal or spatial omnidirectional), but low sensitivity

Method used

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  • Cylindrical stack wafer underwater transducer
  • Cylindrical stack wafer underwater transducer
  • Cylindrical stack wafer underwater transducer

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Embodiment Construction

[0037] The cylindrical stacked wafer transducer of the present invention will be described in detail below with reference to the accompanying drawings and examples.

[0038] like Image 6 As shown, the cylindrical stacked wafer transducer of this example includes a piezoelectric wafer stack composed of piezoelectric ceramic wafers 4, upper and lower metal cover plates 2, prestressed screws 1, rubber sheet 3, base 6, waterproof and sound-permeable layer 9 and output cable 8 etc. In the piezoelectric chip stack, the piezoelectric ceramic chip 4 is made of a circular piezoelectric ceramic PZT with a hole in the center. The outer diameter of the chip is 23 mm, the inner diameter is 5 mm, and the thickness of each chip is 1 mm. Every four wafers form a group of piezoelectric wafers, and the polarization directions of adjacent wafers are opposite (see Figure 7 ). The piezoelectric chip stack is composed of 2 groups of piezoelectric chips. The piezoelectric chip groups are separa...

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Abstract

The invention provides an underwater acoustic transducer, comprising a piezoelectric ceramic wafer pack and metal cover plates on upper and lower ends thereof. The piezoelectric ceramic wafer pack is in a cylindrical shape and stacked by several circular piezoelectric ceramic wafers. Polarization direction of the piezoelectric ceramic wafers is along the thickness direction. 2 to 8 piezoelectric ceramic wafers form a group, and the wafer pack contains one or several groups of wafers, each is separated by a rubber chip. Metal sheets are clamped between adjacent wafers and between a wafer and a rubber chip. Contact conductors are welded on the metal sheets. The piezoelectric ceramic wafer pack and the upper and lower metal cover plates are further separated by the rubber chips. The cylindrical stacked wafer transducer of the invention is not only capable of maintaining characteristics of large transmitting sound energy density of traditional stacked wafer transducer and high sensitivity by reasonably designing diameter of piezoelectric stacked wafers, but capable of adjusting axial directivity open angle of the transducer by changing thickness of the piezoelectric wafer stack or adjusting the group number.

Description

technical field [0001] The invention belongs to the technical field of underwater acoustic detection, and in particular relates to an underwater acoustic transducer which uses the piezoelectric effect of piezoelectric ceramics to emit underwater acoustic signals to realize underwater detection, and can be widely used in underwater communication, detection, target positioning, and tracking etc., are important components used by sonar. Background technique [0002] The underwater acoustic transducer is a device that converts sound energy and electrical energy into each other. Its status is similar to that of an antenna in radio equipment, and it is a key device for transmitting and receiving sound waves underwater. Underwater detection, identification, communication, as well as marine environment monitoring and the development of marine resources are inseparable from underwater acoustic transducers. Transducers can be divided into transmitting type, receiving type and dual-pu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R17/00H04R1/44
Inventor 王丽坤董天晓秦雷李莉张金铎
Owner BEIJING INFORMATION SCI & TECH UNIV
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