Detecting method for packaged chip

Abstract

The invention provides a detection method of a packaged chip; light is used for irradiating an image formed by a lead frame packaged with the chip to detect metal wires between the chip and the packaged lead frame; the method includes the following steps: firstly, a plane plate provided with a plurality of slots for the lead frame is provided; secondly, the lead frame packaged with the chip and the plane plate in the first step are inclined and placed in the slots at a certain angle; thirdly, light is used for irradiating the lead frame with a certain degree of inclination in the second step so as to obtain the images of the metal wires between the chip and the lead frame; fourthly, the images of the metal wires obtained in the third step are observed, and the package is judged to fail when bending deflection appears. The lead frame packaged with the chip is inclined and placed in the slots so that a certain included angle is formed by the irradiated ray and the packaged chip, thereby conveniently detecting whether the metal wires between the chip of the packaged chips and the packaged lead frame have deformation.

Description

technical field [0001] The invention relates to a detection method for a packaged chip, in particular to a detection method for detecting whether there is sagging / deformation in the wiring between the chip and its packaged lead frame. Background technique [0002] When the integrated circuit chip is made into a product, the integrated circuit chip with certain functions is packaged in different types of packaging forms. The packaging of the chip not only plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also serves as a bridge between the microchip and the external circuit. Generally, chip packaging is achieved by using a lead frame (Lead Frame) with several pins, and the contacts on the chip are connected to the leads of the lead frame by wires. Therefore, the quality of the conductive connection between the contacts and the pins directly affects the yield of the chip package. However, in the packaging, due t...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a detection method for a packaged chip, to detect whether there is a wire collapse / deformation between the chip and its packaged lead frame, and to solve the problem of X-ray detection in the traditional detection method due to the rotation angle of the X-ray emitting head. The limitation exists that it is impossible to accurately detect the problem of collapse / deformation of packaged chips

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