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Semiconductor light emitting device

A light-emitting device, semiconductor technology, applied in the direction of semiconductor devices, electric solid-state devices, electrical components, etc., can solve the problem of semiconductor light-emitting device X becoming thicker

Inactive Publication Date: 2010-03-17
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thicker the frame member 91A is, the thicker the semiconductor light emitting device X becomes overall.

Method used

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  • Semiconductor light emitting device
  • Semiconductor light emitting device
  • Semiconductor light emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Figure 1 ~ Figure 3 An example of a semiconductor light emitting device according to the present invention is shown. The illustrated semiconductor light emitting device A includes a lead frame 1 , an LED chip 2 , a Zener diode 3 , a housing 4 , and a light-transmitting member 5 .

[0017] The lead frame 1 is made of, for example, Cu, Ni or their alloys, and includes a first frame member 11 and a second frame member 12 . The lead frame 1 is formed, for example, by pressing a plate-shaped material, and has a constant thickness.

[0018] Figure 4 and Figure 5 The structure of the lead frame 1 is explained, the light-transmitting member 5 is omitted, and the case 4 is shown by a dotted line. As shown in these figures, the first frame member 11 has a die bonding pad 11a, a first raised portion 11b, an easily deformable portion 11c, one terminal 11d, and two terminals 11e. The die bonding pad 11a is a large rectangular part, and the LED chip 2 is bonded to the surface...

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PUM

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Abstract

A semiconductor light emitting device (A) is provided with a leadframe (1) having a fixed thickness; a semiconductor light emitting element (2) supported by the leadframe (1); a case (4) covering a part of the leadframe (1); and a light transmitting member (5) for covering the semiconductor light emitting element (2). The lead frame (1) includes a die bonding pad (11a) and a protruding section (11b). The die bonding pad (11a) has a front surface for mounting the semiconductor light emitting element (2), and a rear surface exposed from the case (4). The protruding section (11b) is arranged by being offset from the die bonding pad (11a) in a normal line direction of the front surface of the die bonding pad (11a).

Description

technical field [0001] The present invention relates to a semiconductor light emitting device including a semiconductor light emitting element. Background technique [0002] Figure 6 An example of a conventional semiconductor light emitting device is shown (for example, refer to Patent Document 1). The semiconductor light emitting device X shown in this figure includes a lead frame 91 , an LED chip 92 , a housing 93 and a light-transmitting member 94 . The lead frame 91 includes two frame members 91A, 91B. The first frame member 91A is thicker than the second frame member 91B, and the LED chip 92 is mounted on the surface thereof. The LED chip 92 is connected to the second frame member 91B through a wire 95 . The casing 93 is made of, for example, white resin. The light-transmitting member 94 fills the space surrounded by the housing 93 and covers the LED chip 92 . A lens 94 a for improving directivity of light emitted from the LED chip 92 is formed on the light-transm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/54H01L33/56H01L33/60H01L33/62H01L33/64
CPCH01L33/647H01L33/486H01L33/62H01L2224/48247H01L25/167H01L2224/48091H01L2924/00014
Inventor 小早川正彦
Owner ROHM CO LTD