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Method for measuring and inspecting an object by means of an image processing system

A technology of image processing and system measurement, applied in image data processing, image enhancement, image analysis, etc., to achieve the effect of simple changes or adjustments

Inactive Publication Date: 2015-08-05
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it has been found to be disadvantageous here that the identification of the weights and thus the setting of the position determination is only restricted by the respective feature group.

Method used

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  • Method for measuring and inspecting an object by means of an image processing system

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Embodiment Construction

[0017] figure 1 A geometric model MOD for an electronic component BE is shown exemplarily and schematically, which model is generated in a first step 1 and used by an image processing system in an automatic assembly machine, for example for object recognition, measurement, etc. The electronic component BE is described by the geometric model MOD according to the exemplary feature groups MG1 , MG2 and MG3 , wherein partial regions of the component BE or the entire component BE can be described by the geometric model MOD. Here, feature groups MG1, MG2, MG3 include, for example, component features and / or their relative positions, such as pins, lead rows AR1, AR2, component lead balls, corners and / or edges of component BE, centering pins ZS and so on.

[0018] exist figure 1 , an exemplary element BE is described in the geometric model MOD in terms of lead lines AR1 , AR2 and centering pins ZS or their relative positions. Here, the feature groups MG1 and MG2 include the respecti...

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Abstract

The method involves generating a geometric model (MOD) for a to-be-measured object (BE), where the object is characterized in the form of characteristic groups (MG1, MG2, MG3) e.g. edges, by the model. A measurement sequence (MA) having two measurement steps (MS1, MS2) is defined for the model. Each measurement step is related to image acquisition (BA1, BA2) of the object and one of the groups. Measurement of the groups and result (ERG1) of one of the steps (MS1) are combined. The measurement sequence is stored as a separate data model.

Description

technical field [0001] The invention relates to a method for measuring and inspecting objects, in particular electronic components in automatic assembly machines, by means of an image processing system, wherein a geometric model is generated for the object to be measured and inspected. The object has different groups of features (for example corners, edges, leads, symbols, centering pins, etc. in electronic components), which are then described by the respective geometric model. However, feature groups have different characteristics and thus different measurement requirements. Background technique [0002] So-called automatic assembly machines are used when assembling components for component carriers such as printed circuit boards. In this case, the components are usually supplied by the component supply at defined pick-up positions and picked up from there by the assembly head. The assembly head can be freely positioned within the working area by means of a positioning s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K13/08G01B11/00
CPCG05B2219/35084G06T2207/30148G06T7/001
Inventor 托马斯·施内肯布格尔
Owner ASM ASSEMBLY SYST GMBH & CO