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Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method

A technology for detection devices and substrates, applied in measuring devices, optical devices, gaseous chemical plating, etc., can solve problems such as inability to accurately detect substrate positions, detection errors, etc.

Inactive Publication Date: 2010-06-16
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, as a result of research by the inventors of the present invention, it has been found that when a substrate is photographed by a camera, a detection error occurs due to light irradiation, and the position of the substrate cannot be accurately detected.

Method used

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  • Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method
  • Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method
  • Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method

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Embodiment Construction

[0047] According to an embodiment of the present invention, there are provided a substrate position detecting device, a substrate position detecting method, a film forming device having the substrate position detecting device, and a film forming device using the substrate position detection device capable of reducing detection errors in detecting the substrate position by imaging the substrate. film-forming method.

[0048] Hereinafter, non-limiting, illustrative embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same or corresponding reference numerals are attached to the same or corresponding members or parts, and repeated explanations are omitted. Moreover, the drawings are not intended to represent relative ratios between members or components, so specific thicknesses and dimensions refer to the following non-limiting embodiments, and should be determined by those skilled in the art.

[0049] Substrate positio...

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Abstract

A disclosed substrate position detection apparatus includes an imaging portion configured to take an image of a substrate subject to a position detection; a panel member provided between the imaging portion and the substrate and including a first opening that ensures a field of view for the imaging portion with respect to the substrate, the panel member having a light scattering property; a first illuminating portion configured to illuminate the panel member; and a processing portion capable of determining a position of the substrate in accordance with the image taken through the first opening by the imaging portion.

Description

technical field [0001] The present invention relates to a substrate position detection device for detecting the position of a substrate housed in a semiconductor element manufacturing apparatus, a substrate position detection method, a film formation device having the substrate position detection device, and a film formation method using the film formation device. Background technique [0002] In the manufacturing process of a semiconductor element, the substrate is transported to various manufacturing devices including a film forming device, an etching device, and an inspection device, and the substrate is subjected to processing corresponding to each device. The substrate is carried into each device by a transfer arm having a fork and an end effector, but the substrate must be accurately arranged at a predetermined position in the device. For example, when the substrate deviates from a predetermined position in the film forming apparatus, problems arise that the substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/00G01B11/00
CPCC23C16/52H01L21/67259G01B11/00H01L21/681C23C16/4584H01L21/68H01L21/20
Inventor 相川胜芳本间学
Owner TOKYO ELECTRON LTD