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Heat radiation material, electronic device and method of manufacturing electronic device

A technology for heat-dissipating materials and electronic devices, which can be used in the manufacture of semiconductor/solid-state devices, electrical solid-state devices, and materials for heat exchange, etc.

Active Publication Date: 2012-07-04
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, traditional heat dissipation materials using carbon nanotubes cannot take full advantage of the high thermal conductivity of carbon nanotubes

Method used

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  • Heat radiation material, electronic device and method of manufacturing electronic device
  • Heat radiation material, electronic device and method of manufacturing electronic device
  • Heat radiation material, electronic device and method of manufacturing electronic device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0034] refer to Figure 1A to Figure 3C A carbon nanotube sheet and a method of manufacturing the carbon nanotube sheet according to the first embodiment are described.

[0035] Figure 1A and Figure 1B is a schematic cross-sectional view showing the structure of the carbon nanotube sheet according to the present embodiment. Figure 2A-Figure 3C is a cross-sectional view showing a method of manufacturing a carbon nanotube sheet according to this embodiment.

[0036] First, refer to Figure 1A and Figure 1B The structure of the carbon nanotube sheet according to this embodiment is described. Figure 1A is a view showing the structure of the first example of the carbon nanotube sheet according to the present embodiment. Figure 1B is a view showing the structure of a second example of the carbon nanotube sheet according to the present embodiment.

[0037] Such as Figure 1A and Figure 1B As shown, the carbon nanotube sheet according to this embodiment includes a pluralit...

no. 2 example

[0070] refer to Figure 4 to Figure 8 A carbon nanotube sheet and a method of manufacturing the carbon nanotube sheet according to the second embodiment are described. In this example and Figure 1A to Figure 3C Components that are the same as those in the carbon nanotube sheet according to the first embodiment and the method for manufacturing the carbon nanotube sheet shown in , are denoted by the same reference numerals, and their descriptions will not be repeated or simplified.

[0071] Figure 4 is a schematic cross-sectional view showing the structure of the carbon nanotube sheet according to the present embodiment. Figure 5A-Figure 5C is a cross-sectional view showing a method of manufacturing a carbon nanotube sheet according to this embodiment. Figure 6-Figure 8 is a cross-sectional view showing a method of manufacturing a carbon nanotube sheet according to this embodiment.

[0072] First, refer to Figure 4 The structure of the carbon nanotube sheet according t...

no. 3 example

[0092] refer to Figure 9A to Figure 14 A carbon nanotube sheet and a method of manufacturing the carbon nanotube sheet according to the third embodiment are described. In this example and Figure 1A to Figure 8 The same components in the carbon nanotube sheet and the method for manufacturing the carbon nanotube sheet according to the first embodiment and the second embodiment shown in , are denoted by the same reference numerals, and they will not be repeated or simplified. description of.

[0093] Figure 9A and Figure 9B is a perspective view showing the structure of the carbon nanotube sheet according to the present embodiment. Figure 10A-Figure 13 It is a perspective view showing a method for manufacturing a carbon nanotube sheet according to this embodiment. Figure 14 It is a perspective view illustrating a method for manufacturing a carbon nanotube sheet according to another example of this embodiment.

[0094] First, refer to Figure 9A and Figure 9B The st...

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Abstract

The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Description

technical field [0001] Embodiments discussed herein relate to a heat dissipation material, and more particularly, to a heat dissipation material including a linear structure of carbon atoms, an electronic device using the heat dissipation material, and a method of manufacturing the electronic device. Background technique [0002] Electronic components in CPUs (Central Processing Units) used in servers, personal computers, etc. need to efficiently dissipate heat generated by semiconductor elements. For this purpose, structures are used in which a heat spreader made of a highly thermally conductive material (for example copper, etc.) is arranged on a semiconductor element on which a thermal interface material is provided. [0003] The thermal interface material itself needs to be a material with high thermal conductivity, and in addition, it needs to have the property that the material can contact the heat source and the micro unevenness on the surface of the heat transfer dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L21/50H01L21/54H01L21/56C09K5/06
CPCH01L24/28H01L2924/01023H01L2924/01046H01L2924/0105H01L2924/01041H01L2924/16152H01L2924/01049H01L2924/01018H01L2224/16H01L2224/73253H01L2924/01019H01L2924/01029H01L23/373H01L2924/01027H01L2924/014H01L2924/01013Y10S977/742H01L2924/01072H01L2924/10158Y10S977/739H01L2924/04941H01L2924/01047H01L2924/04953H01L2924/01079H01L23/433H01L2924/0104H01L23/3733H01L2924/01005H01L2924/01033H01L2924/01006H01L24/31H01L2924/01074H01L2924/01078H01L2924/01042H01L2924/01073Y10S977/734H01L2924/01012H01L2224/16225H01L2924/15788H01L2224/83365H01L2224/29499H01L2924/00014H01L2924/00011Y10T428/30Y10T29/49002Y10T428/31504F28F3/022H01L2924/00H01L2224/0401
Inventor 岩井大介近藤大雄山口佳孝广濑真一崎田幸惠曾我育生八木下洋平
Owner FUJITSU LTD
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