Chemical mechanical polishing machine and chemical mechanical polishing equipment with same
A technology of chemical machinery and polishing machine, which is applied in the direction of metal processing equipment, grinding machine tools, manufacturing tools, etc. It can solve the problems of increased difficulty and different positions of polishing heads, and achieve the effects of simple structure, simple processing and high production efficiency
Active Publication Date: 2012-02-15
HWATSING TECH
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Problems solved by technology
The error caused by each rotation of the polishing head bracket will be different, which makes it more difficult to adjust the position of the polishing head
Method used
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Embodiment Construction
[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0026] In the description of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom" etc. indicate The orientation or positional relationship shown in the drawings is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and does not require that the present invention must be constructed and operated in a specific orientation, so it should not be construed as a limit...
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The invention discloses a chemical mechanical polishing machine, comprising a work platform, a polishing disc, a trimmer, a polishing fluid delivery device, a loading platform, a polishing head, a manipulator and a polishing head support, wherein the polishing head support is installed on the upper surface of the work platform and comprises a level substrate and support side plates, a groove is formed on the level substrate and is through along the direction of the thickness thereof; the groove is open along one longitudinal end of the level substrate and extends towards the other level longitudinal end of the level substrate; the support side plates are respectively connected with the level substrate and are respectively arranged at two transverse sides of the groove to support the levelsubstrate; and one longitudinal end of the level substrate longitudinally extends to exceed the support side plates to form a cantilever end which extends above the polishing disc. The chemical mechanical polishing machine of the invention has the advantages of simple structure, convenient processing and high production efficiency. The invention also provides chemical mechanical polishing equipment with the chemical mechanical polishing machine.
Description
technical field [0001] The invention relates to the field of chemical mechanical polishing equipment, in particular to a chemical mechanical polishing machine and a chemical mechanical polishing equipment equipped with it. Background technique [0002] In the production process of large-scale integrated circuits, planarizing the deposition on the wafer is a necessary and frequent process. At present, the chemical mechanical polishing (CMP) process is mainly used to complete this process. The chemical mechanical polishing machine is the main equipment to complete this process. [0003] A traditional chemical mechanical polishing machine usually includes a working platform, three polishing discs installed on the working platform, a loading and unloading platform, four polishing heads and a cross-shaped polishing head support. Two adjacent two of the four cantilevers of the cross-shaped polishing head support are perpendicular to each other and can absorb a polishing head res...
Claims
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IPC IPC(8): B24B37/04H01L21/304B24B37/34
Inventor 路新春许振杰何永勇王同庆沈攀赵德文梅赫赓张连清裴召辉雒建斌
Owner HWATSING TECH