Unlock instant, AI-driven research and patent intelligence for your innovation.

Mask for solder printing and manufacturing method for printed circuit board using the same

A technology for printed circuit boards and masks, which is applied in the direction of assembling printed circuits, circuits, and electrical components with electrical components, and can solve problems such as misalignment, short circuit, and excessive solder paste printing

Inactive Publication Date: 2011-04-27
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Therefore, according to the prior art, there are some problems that the solder paste for surface mount devices is printed too much so that short circuits and / or misalignment (mismatch) often occur, and not enough solder paste for manual insertion of devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mask for solder printing and manufacturing method for printed circuit board using the same
  • Mask for solder printing and manufacturing method for printed circuit board using the same
  • Mask for solder printing and manufacturing method for printed circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Since the invention allows for various changes and embodiments, specific embodiments are shown in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to a specific mode of implementation, and it should be understood that all changes, equivalents, and substitutions that do not depart from the spirit and technical scope of the present invention are encompassed within the present invention. In the description of the present invention, certain detailed descriptions of related art are omitted when it is considered that they may unnecessarily obscure the essence of the invention.

[0017] A mask for solder paste printing and a method for manufacturing a printed circuit board using the mask according to some embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Those parts that are the same or correspond are given the same reference numer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a mask for solder printing and a manufacturing method for printed circuit board using the same. The mask comprises the following components: a plate with a through hole; a nozzle part which projects downwards from the plate correspondingly with the through hole; and a supporting member which is used for supporting the plate and projects downwards from a lower surface of the plate.

Description

[0001] References to related applications [0002] This application claims the benefit of Korean Patent Application No. 10-2009-0095169 filed with the Korean Intellectual Property Office on October 7, 2009, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a mask for solder printing and a method for manufacturing a printed circuit board using the mask. Background technique [0004] In general, substrates for printed circuit boards (PCBs) are made of polyimide films, polyester films, etc., because of their excellent thermal, electrical, and mechanical properties. An adhesive material is dispensed on the substrate and a metal foil, such as copper or aluminum, is adhered to the substrate. Then, by using a metal foil, a circuit pattern is formed on the substrate, and a cover film is coated on the substrate in order to protect the circuit pattern. Through these steps, a PCB is manufactured. [0005] On...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH01L2224/83192
Inventor 金准坤李明九
Owner SAMSUNG ELECTRO MECHANICS CO LTD