Practical electronic product service life evaluation model parameter high-accuracy extraction method

A technology of electronic products and model parameters, which is applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., and can solve problems such as difficulty in extracting model parameters, affecting model accuracy, limiting engineering application scope and effects, etc.

Active Publication Date: 2011-06-22
北京可维创业科技有限公司
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Problems solved by technology

However, in actual use, there are problems such as uncertainty factors affecting the accuracy of the model and difficulty in extracting model parameters, which limit the scope and effect of engineering applications based on failure physics models.

Method used

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  • Practical electronic product service life evaluation model parameter high-accuracy extraction method
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  • Practical electronic product service life evaluation model parameter high-accuracy extraction method

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Embodiment Construction

[0054] The following will combine figure 1 And the case of the evaluation model of thermal fatigue life of solder joints of electronic products, the present invention is further described in detail.

[0055] See figure 1 As shown, it is a schematic flow chart of the implementation steps of the method of the present invention. For the case of the evaluation model of the thermal fatigue life of the electronic product solder joint, the model parameters are extracted and determined.

[0056] (1) The thermal fatigue failure of electronic product packaging solder joints under temperature cycle stress is an important factor affecting the life of electronic products. Based on a certain degree of simplification and assumptions, the Engelmaier model (also known as the modified Coffin-Manson model) can be used to evaluate the number of temperature cycles before failure due to thermal fatigue fracture of solder joints, that is, the fatigue life. This model is applicable to solder joints...

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Abstract

The invention discloses a practical electronic product service life evaluation model parameter high-accuracy extraction method, which comprises the following steps of: (1) determining a failure physical model and model parameters to be extracted; (2) acquiring mean values, upper limits and lower limits of geometric and material parameters of a product, and representing the uncertainty of the parameters by adopting process capability indexes; (3) evaluating initial model parameters of the failure physical model according to the mean values of the geometric and material parameters of the product; (4) performing sampling according to distribution types of the geometric and material parameters to obtain random values of the geometric and material parameters; (5) obtaining the random value of the service life of the product by combining a Monte-Carlo simulation method; (6) obtaining a theoretical distribution function of the service life of the product according to the random value of the service life; (7) processing experimental failure data by adopting a remaining ratio method to obtain an empirical distribution function of the service life of the product; (8) checking a degree of fitting of the two service life distribution function by utilizing a K-S checking method; and (9) performing optimal extraction on the model parameters until the model parameters with an optimal degree of fitting are obtained.

Description

(1) Technical field: [0001] The present invention provides a practical high-precision extraction method for life evaluation model parameters of electronic products, and in particular relates to a method for combining a double-distribution K-S test method with a Monte-Carlo simulation method and using limited test failure data to extract model parameters. It belongs to the life evaluation and reliability prediction technology of electronic products. (two) background technology: [0002] At present, standards or manuals such as GJB / Z 299C (Chinese military standard - electronic equipment reliability prediction manual) and MIL-HDBK-217F (US military standard - electronic equipment reliability prediction) are mainly used in engineering practice to test electronic products / equipment The failure rate is predicted. This standard- or manual-based approach is a probabilistic approach based on a large number of failure statistics (including field or laboratory statistics), and its co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00
Inventor 孙博冯强曾声奎任羿郭健彬马纪明
Owner 北京可维创业科技有限公司
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