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Press-in connections for electronic modules

A technology of electronic modules and connection systems, which is applied in the direction of connection, fixed connection, parts of connection devices, etc., and can solve problems such as installation problems and high costs

Inactive Publication Date: 2016-04-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, it is necessary to ensure that the pressure contact elements are not deformed before installing the circuit board and the module, because otherwise there may be problems during installation
In addition, the pressure contact elements on the module housing are connection elements that are geometrically relatively cost-intensive to produce
Due to the remaining deformation of the contact elements at the module, it is often not possible to remove the force-fit contact and reconnect it without high costs

Method used

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  • Press-in connections for electronic modules
  • Press-in connections for electronic modules
  • Press-in connections for electronic modules

Examples

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Embodiment Construction

[0022] In the drawings, the same reference numerals denote the same or similar components with the same or similar meanings.

[0023] Figure 1a A power semiconductor module 10 is schematically shown with a plurality of force-fit pins 30 for contacting a circuit board 20 . In the example shown, the module 10 is pressed into the circuit board 20 by means of screws 40 and is at the same time screwed to the heat sink, wherein due to the force exerted on the module 10 when screwing in the screws, the force-fit pins 10 are pressed into corresponding contact holes of the circuit board 20 . exist Figure 1b A further module 10 is shown in a perspective view without a circuit board, which has force-fit pins 30 arranged at the module housing. The module is first screwed onto the heat sink and can then be pressed into the circuit board independently of this. The pressure connection system shown in FIG. 1 is described inter alia in the paper "Reliability of press FIT connections" by T...

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Abstract

The invention relates to a press-fit connection for an electronic module. A pressure connection element is disclosed for pressing into a first contact opening of a first connection element and a second contact opening of a second connection element. The pressure connection element has: an elongated base body for passing through the second contact opening of the second terminal element until reaching the first contact opening of the first terminal element; and a first press-in area for force-fitting and a second press-in area spaced apart from the first press-in area in a longitudinal direction for contacting the second contact opening in a force-fitting manner.

Description

technical field [0001] The invention relates to a novel press-in connection for connecting electronic modules, such as power semiconductor modules, to circuit boards, supply lines, etc. Background technique [0002] Important aspects for the user when selecting a power semiconductor module are their simple handling and installation. Modern module housing designs use, for example, special press-fit technology (the so-called "PressFIT" technology) in order to connect the module both to the circuit board and to the cooling body in a single manufacturing step, for example. For such a connection, for example, only a single screw is required. Such a press-in connection thus offers a high-quality alternative to known soldered connections and thus meets the requirements of modern rectifier designs in the power range up to 55 kW. Such power semiconductor modules can be used in various universal drives, variable frequency drives, uninterruptible power supplies (USV), induction heati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/58H01R13/633H01R13/40H01R13/46
CPCH01R12/585
Inventor R.拜尔雷尔
Owner INFINEON TECH AG