Novel diepoxide

A technology of diepoxy compounds and compounds, applied in the direction of organic chemistry, etc., can solve the problems of unsatisfactory hygroscopicity, unsatisfactory low melting point and solvent solubility, low flame retardancy, etc., and achieve excellent low hygroscopicity , Excellent solution solubility, excellent flame retardancy and excellent hygroscopicity

Inactive Publication Date: 2014-12-10
HONSHU CHEM INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, these diepoxy compounds known in the prior art require improvement because they are still unsatisfactory in terms of heat resistance, flame retardancy, and low moisture absorption when used as cured resins, and when processing them They are also unsatisfactory in terms of low melting point and solvent solubility when

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] 1-(4-glycidyloxy-3-phenylphenyl)-4-(4-glycidyloxyphenyl)benzene (1-(4-glycidyloxy-3-phenylphenyl)-4-(4-glycidyloxyphenyl)benzene )Synthesis

[0101]

[0102] 10.0g1-(4-hydroxyl-3-phenylphenyl)-4-(4-hydroxyphenyl)benzene, 1.9g tetrabutylammonium bromide and 82.1 g epichlorohydrin, stirred at 50° C. for 9 hours after purging the inside of the system with nitrogen. 3.5 g of sodium hydroxide was added to the reaction solution and further stirred for 4 hours. After the reaction was completed, 100 g of toluene and 40 g of distilled water were added, stirred at 30° C. for 1 hour, and then the precipitated crystals were filtered. The obtained crystals were dried under reduced pressure at 50° C. to obtain 11.5 g of the target substance, i.e. 1-(4-oxyglycidyl-3-phenylphenyl)-4-(4-oxyglycidylphenyl) Benzene: white powdery crystals with a purity of 96% (high performance liquid chromatography).

[0103] The yield, based on the starting material 1-(4-hydroxy-3-phenylphenyl)-4...

Embodiment 2

[0109] 1-(4-glycidyloxy-3-phenylphenyl)-4-(4-glycidylphenyl)-1-cyclohexene (1-(4-glycidyloxy-3-phenylphenyl)-4-( 4-glycidyloxyphenyl)-1-cyclohexene) synthesis

[0110]

[0111] 10.0g1-(4-hydroxy-3-phenylphenyl)-4-(4-hydroxyphenyl)-1-cyclohexene, 1.9g tetrabutyl Ammonium bromide and 81.0 g of epichlorohydrin were stirred at 50° C. for 19 hours after purging the inside of the system with nitrogen. 3.5 g of sodium hydroxide was added to the reaction solution and further stirred for 4 hours. After the reaction was completed, the reaction solution was concentrated by distillation to remove excess epichlorohydrin, 100 g of methyl isobutyl ketone and 40 g of distilled water were added, and the water layer was removed after stirring.

[0112] Water was added to the obtained oil layer, and the operation of washing with water and removing the water layer was repeated until the pH of the water layer reached 7. The obtained oil layer was concentrated by distillation to remove methyl...

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Abstract

The invention provides a novel diepoxide, which has good heat resistance and flame retardation and low moisture absorption, and low melting point and good solvent dissolution. The diepoxide is expressed by a formula (1), wherein R1 represents a hydrogen atom or methyl; R2 and R3 respectively and independently represent alkyl having 1-8 carbon atoms, alkoxy having 1-8 carbon atoms or phenyl; a and b respectively and independently represent 0 or an integer from 1 to 4, but a and b cannot be 0 at the same time; at least one of substituent groups represented by R2 and R3 is phenyl; A is a divalent group expressed by the following formula (2) or formula (3). In the formula (2), R4 represents alkyl having 1-8 carbon atoms, alkoxy having 1-8 carbon atoms or phenyl; a represents 0 or an integer from 1 to 4. In the formula (3), R5 represents alkyl having 1-8 carbon atoms, alkoxy having 1-8 carbon atoms or phenyl; d represents 0 or an integer from 1 to 4.

Description

technical field [0001] The present invention relates to a novel diepoxide. Background technique [0002] Epoxy resins are widely used in various fields such as adhesives, coatings, general industrial structural materials, and electronic / electrical device components or materials. In recent years, with the expansion and development of applications to these epoxy resins, there has been a strong demand for further improvements in workability and various properties including heat resistance, moisture resistance, chemical resistance, electrical characteristics, and mechanical characteristics . Therefore, there is a need to develop novel epoxy compounds that meet such demands. [0003] Hitherto, diepoxides derived from many polynuclear bisphenols have been known as raw materials for epoxy resins having excellent heat resistance, or as diepoxides having a low melting point. For example, 4,4'-[1,4-phenylenebis(1-methylethylene)bis(phenyleneoxymethylene oxide)] (4,4'-[1,4 -phenyle...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C07D303/27
Inventor桥本祐树
OwnerHONSHU CHEM INDAL