Unlock instant, AI-driven research and patent intelligence for your innovation.

A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof

A conductive substrate and holder technology, applied in the field of substrate holders, can solve the problem that the backside of the workpiece cannot be ensured to be separated from the electrolyte.

Active Publication Date: 2011-11-23
CT DE RECH PUBLIC GABRIEL LIPPMANN
View PDF1 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the electrodes are arranged such that they can slide through the substrate holder, thus not ensuring separation of the backside of the workpiece from the electrolyte

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof
  • A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof
  • A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Several embodiments of the present invention will be described below with reference to the accompanying drawings. These embodiments are described in order to enable those skilled in the art to practice the invention. However, such embodiments do not limit the invention, and other combinations of different features are possible within the scope of the invention.

[0032] refer to figure 1 , shows a general cross-sectional view of the electroplating treatment apparatus 100 . This figure is a simplified diagram of the principle of operation of a plating process and is intended to illustrate the role of the substrate holder 101 in such a process.

[0033] During an electroplating process according to one embodiment of the present invention, a conductive substrate 102 is attached to a substrate holder 101 . The conductive substrate 102 may be a wafer of conductive and / or semiconducting material, such as a metallic material, or a doped semiconducting material, such as sili...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided.

Description

technical field [0001] The present invention relates to substrate holders for use in electroplating processes. More particularly, the present invention relates to a substrate holder comprising physically adaptable contact means arranged to provide electrical contact to cavities on the backside of an electrically conductive substrate connected to the substrate holder. A method of arranging a substrate into a substrate holder is also provided. Background technique [0002] Electroplating is used for microelectronic components such as interconnects, components, waveguides, inductors, contact pads, etc. in a variety of applications. [0003] For example, the main electrode made by the present invention is suitable for the manufacture of microstructures or nanostructures involving single or multilayer, PWB (printed wiring board), PCB (printed circuit board), MEMS (microelectromechanical system), IC ( Integrated Circuits) interconnects, interconnects on ICs, sensors, flat panel ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/06
CPCC25D17/005C25D17/06C25D17/00C25D17/001C25D17/002
Inventor 米卡埃尔·弗雷登贝格帕特里克·莫勒
Owner CT DE RECH PUBLIC GABRIEL LIPPMANN