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Pin implanting equipment and pin implanting method

A kind of equipment and pin planting technology, which is applied in the direction of metal processing equipment, metal processing, manufacturing tools, etc., can solve the problems that pins of different specifications cannot be driven in differently, and the operation is inconvenient.

Active Publication Date: 2013-08-28
OFUNA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] An existing fixing and separating device for multiple substrates (Japanese Patent Publication No. H04-82629) uses a reference pin driving device to drive several reference pins in bulk into a multiple substrate one by one. In a reference hole, and using a fixing pin driving device to drive several fixing pins arranged in a row of nails into several fixing holes of the multiple substrate one by one, however, in each pass of the operation During the process, regardless of the reference pin driving device or the fixed pin driving device, it can only drive pins of a single specification, and it is impossible to drive pins of different specifications in the same pass. In holes of different sizes, it is not convenient to work

Method used

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  • Pin implanting equipment and pin implanting method
  • Pin implanting equipment and pin implanting method
  • Pin implanting equipment and pin implanting method

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Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0021] The aforementioned and other technical contents, features and effects of the present invention will be clearly understood in the following detailed description of a preferred embodiment with reference to the drawings.

[0022] refer to figure 1 , 2 , is a preferred embodiment of the pin planting equipment of the present invention, and the pin planting equipment includes: a body 10, an X-axis workbench 20, a Y-axis slide 30, at least one Y-axis guide group, and a Z-axis saddle seat 50, and at least one pinning module 60. In this embodiment, the pin planting equipment includes two Y-axis guide groups 40I and 40II, and six pin planting modules 60 . In addition, it can be understood that the present invention can be combined with several spindle devices (not shown) to form a multi-axis substrate processing machine. On the side of the planting p...

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Abstract

The invention relates to pin implanting equipment and a pin implanting method. The pin implanting equipment comprises a machine body, an X-axis worktable, a Y-axis sliding seat, a Z-axis saddle and at least one pin implanting module, wherein the machine body is provided with a bed station and a beam; the X-axis worktable can be movably arranged on the bed station along an X-axis direction; the Y-axis sliding seat can be movably arranged on the beam along a Y-axis direction; the Z-axis saddle can be movably arranged on the Y-axis sliding seat along a Z-axis direction; the pin implanting moduleis provided with a pin preimplanting device and a hamming device; the pin preimplanting device is provided with a linear driving part and a clamping unit; the linear driving part is arranged on the Z-axis saddle; the clamping unit is driven by the linear driving part to lift and descend along the Z-axis direction; the clamping unit is provided with a driving body and a plurality of clamping jaws which are respectively arranged on the driving body; the clamping jaws are driven by the driving body to be relatively close to each other or far away from each other; and the hamming device is provided with a striking power part arranged on the Y-axis sliding seat and a hammer head which is driven by the striking power part to lift and descend along the Z-axis direction.

Description

technical field [0001] The invention relates to a pin implantation device, in particular to a pin implantation device suitable for implanting positioning pins of different specifications. Background technique [0002] An existing fixing and separating device for multiple substrates (Japanese Patent Publication No. H04-82629) uses a reference pin driving device to drive several reference pins in bulk into a multiple substrate one by one. In a reference hole, and using a fixing pin driving device to drive several fixing pins arranged in a row of nails into several fixing holes of the multi-substrate one by one, however, in each pass of the operation During the process, regardless of the reference pin driving device or the fixed pin driving device, it can only drive pins of a single specification, and it is impossible to drive pins of different specifications in the same pass. In holes of different sizes, it is inconvenient to operate. Contents of the invention [0003] An ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P19/00B23P19/027
Inventor 黄国旭
Owner OFUNA TECH