Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc

Abstract

The invention relates to a solar cell or semiconductor wafer adsorbing device and particularly relates to an ultrathin umbrella-flow-type non-contact silicon wafer sucking disc, which comprises a sucking disc body and a spray nozzle. A cylindrical hole, a circular chamber and an umbrella air flow chamber are sequentially arranged on the sucking disc body along a central axis. A transverse cylinder and a longitudinal cylinder which are perpendicular to each other form a T-shaped structure of the spray nozzle. A circular step is arranged at the connected part of the transverse cylinder and the longitudinal cylinder. The longitudinal cylinder is in interference fit with the cylindrical hole of the sucking disc body. A principle that umbrella air flows generate a vacuum is used to clamp and deliver silicon wafers, in the adsorbing process, the edge of the sucking disc is used as a static-pressure support, not only can a workpiece be adsorbed, but also the workpiece is ensured not to be incontact with the sucking disc and the wafers can be prevented from rotating, vibrating and the like.

Description

technical field [0001] The invention relates to an adsorption device for solar cells or semiconductor wafers, in particular to an ultra-thin umbrella flow non-contact silicon wafer adsorption device. Background technique [0002] The clamping and transportation of silicon wafers is an important link in the production process of solar silicon wafers and semiconductors, which greatly affects the quality and reliability of silicon wafers. In the prior art, the clamping and conveying of the silicon wafer is mainly carried out by the contact vacuum chuck technology. That is, the lower surface of the silicon wafer is attached to the conveying robot by vacuum adsorption, which ensures the stability of the silicon wafer conveying process. However, the direct contact with the suction cup will easily lead to uneven stress on the silicon wafer, which will easily cause problems such as warping and deformation of the silicon wafer. In addition, the use of contact clamping will inevita...

AI Technical Summary

Problems solved by technology

However, the introduction of the vortex flow resulted in the generation of shear force on the surface of the silicon wafer

Under the traction of shear force, the clamped silicon wafer is forced to rotate, resulting in an unstable state of the silicon wafer

In severe cases, it may even vibrate in the vertical direction and collide with other components, thus affecting the effective implementation of the scheme

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