Preparation method of diamond wire and prepared diamond wire

A diamond wire and diamond particle technology, applied in metal material coating process, coating and other directions, can solve the problems of low strength of diamond wire, easy to break, easy to fall off of diamond particles, etc. shedding effect

Active Publication Date: 2013-09-25
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a diamond wire preparation method and the diamond wire prepared by it, so as to solve the technical problems that the strength of the diamond wire is low and easy to break, and the diamond particles are easy to fall off.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Step 1: Diamond and Metal Powder Mixing

[0035] Diamonds with a particle size of 9-15 μm are degreased through 10% Na(OH) aqueous solution, rinsed with water, and then pickled with 5% aqua regia to remove impurities on the surface of the diamond. Tin powder with an average particle size of 12 μm, lead powder with an average particle size of 8 μm and copper powder with an average particle size of 25 μm are mixed in a weight ratio of diamond: tin: lead: copper=1:4:5:1.5. The mixed powder is placed in a mixer equipped with an alcohol dispersant and mixed and ball-milled at a ball-to-material ratio of 5:1, and the ball-milling medium used is cemented carbide with a particle size of 3 mm. A powder mixture is obtained.

[0036] Step 2: Heating the mixed powder with an induction coil

[0037] Take the mixed powder obtained in the first step and put it into a crucible, then place the crucible in a container equipped with an induction heating device, and heat the mixed powder...

Embodiment 2

[0043] Step 1: Diamond and Metal Powder Mixing

[0044] Take diamond powder with a particle size range of 35-70 μm, degrease through 10% Na(OH) aqueous solution, rinse with water, and then pickle with 5% aqua regia to remove impurities on the diamond surface. Tin powder with an average particle size of 4 μm, lead powder with an average particle size of 5 μm and copper powder with an average particle size of 6 μm are mixed in a weight ratio of diamond: tin: lead: copper=1.1:5:6.5:2. The mixed powder was placed in a mixer equipped with a dispersant SPS and mixed and ball-milled at a ball-to-material ratio of 4:1, and the ball-milling medium used was stainless steel balls with a particle size of 10 mm. A powder mixture is obtained.

[0045] Step 2: Resistance wire heating mixed powder

[0046] Put the mixed powder obtained in the first step into a crucible, then place the crucible in a container equipped with a resistance wire heating device, and heat the mixed powder to 330°C ...

Embodiment 3

[0051] Step 1: Diamond and Metal Powder Mixing

[0052] Take diamond powder with a particle size distribution range of 70-100 μm, degrease through 10% Na(OH) aqueous solution, rinse with water, and then pickle with 5% aqua regia to remove impurities on the diamond surface. Tin powder with an average particle size of 8 μm, lead powder with an average particle size of 9 μm and copper powder with an average particle size of 3 μm are mixed in a weight ratio of diamond: tin: lead: copper=1.2:6.5:8:2.5. The mixed powder is placed in a mixer and mixed and ball-milled at a ball-to-material ratio of 3:1 to obtain a powder mixture;

[0053] Step 2: Induction Heating Mixed Powder

[0054] Put the mixed powder obtained in the first step into a crucible, then place the crucible in a container equipped with an induction heating device, and heat the mixed powder to 350°C to obtain an alloy melt containing diamond particles;

[0055] The third step: diamond particle alloy melt cladding

[...

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Abstract

The invention provides a preparation method of a diamond wire and the prepared diamond wire. The method comprises the following steps: passing a molybdenum wire through alloy melt formed by mixing diamond particles, tin powder, lead powder and copper powder in a constant speed of 2-8m / s and obtaining the diamond wire. The prepared diamond wire has higher flexibility; the anti-twisting property is obviously increased and the diamond wire can not be broken easily during the diamond wire cutting process with high tension and large pulling force.

Description

technical field [0001] The invention relates to the field of diamond wires, in particular to a method for preparing diamond wires. In addition, the present invention also relates to a diamond wire produced by the above method. Background technique [0002] Diamond wire is a cutting tool made by consolidating high hardness and high wear resistance diamond abrasive grains on the surface of steel wire matrix. Diamond wire can not only process ordinary hard and brittle materials such as stone and glass, but also can be as small as 0.15mm because of its narrow kerf. Therefore, it is especially suitable for cutting precious hard and brittle materials such as gemstones, agate, ceramics, and crystals. Diamond wire can be made into different diameters and lengths according to the needs of the material to be cut; diamond wire can also be installed on different equipment to form different processing methods, such as reciprocating cycle (saw frame) type, high-speed band saw type, Sin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/00
Inventor 郭伟信
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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