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Etchant composition for the formation of a metal line

A composition and etching technology, applied in the direction of surface etching compositions, electrical components, circuits, etc., can solve problems such as reduced productivity, underlying film and equipment damage

Active Publication Date: 2012-05-23
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when HF is used for wet etching, the process conditions will be limited because of the possibility of damage to the underlying film and equipment, thereby reducing productivity

Method used

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  • Etchant composition for the formation of a metal line
  • Etchant composition for the formation of a metal line
  • Etchant composition for the formation of a metal line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 11 and comparative example 1 to 5

[0035] Examples 1 to 11 and Comparative Examples 1 to 5: Preparation of Etching Compositions

[0036] The ingredients and composition ratios required for each etching composition to prepare 180kg are given in the following table 1

[0037] [Table 1]

[0038] h 2 o 2

NH 4 FHF

iminodiacetic acid

ammonium nitrate

C6H5N3

CH 3 COOH

water

Example 1

25

1

3

3

0

0

68

Example 2

20

1

5

1

0

0

73

Example 3

15

1

3

0.5

0

1

79.5

Example 4

15

1.2

4

2

0

0

77.8

Example 5

10

1

5

3

0

0

81

Example 6

25

1

3

3

0

3

65

Example 7

20

1

5

1

0

4

69

Example 8

15

1.2

4

2

0

2

75.8 ...

Embodiment 11

[0057] As shown in the above table 3, it can be determined that the variation of the side etching of the etching composition of Example 11 depending on the number of etching layers is greater than the variation of the side etching of the etching composition of Example 10, and the etching of the etching composition of Example 11 is linear Less linear than the Example 10 etching composition. Meanwhile, it was confirmed that the etching compositions of Examples 10 to BLK did not vary much in side etching, and that the etching composition of Example 10 was excellent in etching linearity even in the case of 1000 layers.

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Abstract

The present invention relates to an etchant composition for the formation of a metal line. The etchant composition can wet-etch, in a batch, a single-layer film formed of one or more metals selected from a group consisting of titanium, titanium alloy, aluminum, and an aluminum alloy, or a multilayer film including a double-layer film, thus simplifying the etching process and improving productivity. Further, the etchant composition of the present invention has a high etching rate, prevents damage to a lower film and equipment, enables uniform etching, provides excellent etching characteristics, eliminates the need for expensive equipment, is advantageous when used for large display devices, and provides remarkable economical advantages.

Description

technical field [0001] The invention relates to an etching composition, which is used for wet etching the single-layer film or multi-layer film of grid and source / drain of flat panel display, and the single-layer film or multi-layer film is selected from titanium, titanium alloy, aluminum Made of at least one of the group consisting of aluminum alloy and aluminum alloy. Background technique [0002] In a flat panel display, the method of forming metal lines on a substrate includes the following processes: forming a metal film by sputtering; coating a photoresist material on the metal film; exposing and developing a selected area of ​​the photoresist material to form a resist pattern ; and etching the metal film. The method may further include cleaning processes before and after the single unit process. Here, the etching process is a process of selectively removing a metal film using a photoresist mask. The etching process is generally a dry etching process using plasma or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K13/08C23F1/10
CPCH01L21/32134C23F1/44C23F1/20C09K13/08C23F1/26
Inventor 林玟基梁承宰李喻珍朴英哲权五柄
Owner DONGWOO FINE CHEM CO LTD
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