Self-adaptive noise suppression driver circuit

Abstract

The invention relates to a self-adaptive noise suppression driver circuit which comprises a driver module, a speed down module, an induction module and a speed up module, wherein the output end of the speed down module is connected with the driver module, and the speed down module is used for increasing the rise time and the fall time of an output signal of the driver module; the input end of the induction module is connected with the output end of the driver module, and the induction module inducts the change of the rise time and the fall time of the output signal of the driver module and outputs an induction signal; and the input end of the speed up module is connected with the output end of the induction module, the output end of the speed up module is connected to the driver module in a feedback manner, and the speed up module automatically reduces the rise time and the fall time of the output signal of the driver module according to the induction signal, and increases the driving capability of the driver module. The driver circuit provided by the invention has self-adaptive capability and automatically adjusts the rise time and the fall time of the output signal according to the different external load capacitors, and further, the synchronous switching noise of the output signal is reduced and the driving capability is increased, and the distortion of signals is reduced.

Description

technical field [0001] The invention relates to an adaptive noise suppression driving circuit. Background technique [0002] Simultaneous switching noise (Simultaneous Switch Noise, SSN) has become a very important issue in modern integrated circuit design. When multiple devices are in the switching state at the same time, an instantaneously changing current (di / dt) is generated, and when passing through the inductance on the return path, an AC voltage drop is formed, and the noise caused by it is sometimes called synchronous switching output noise (Simultaneous Switch Output Noise, SSON). If the ground plane fluctuates due to the package inductance, causing the chip ground and the system ground to be inconsistent, we call this phenomenon Ground Bounce; if it is due to the power supply difference between the chip and the system caused by the package inductance, it is called Power Bounce. [0003] attached figure 1 is the equivalent model of the chip package pins, where C...

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Problems solved by technology

However, its driving capability is still limited. When the load is heavy, it will also cause a large distortion of the output signal, thus limiting its application range.

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