A simulation model is provided for flip-chip BGAs to help engineers determine the effects of IC package components. The simulation model includes a bump model, a package planes model, a package bypass capacitor model, a ball model and a PCB model. The simulation model in particular includes resistors, inductors, capacitors and transmission lines to simulate the electrical interaction between signal conductors, power/ground planes, vias and balls that exist in a flip-chip ball grid array (BGA) package. The simulation model helps engineers understand actual physical effects of flip-chip and IC package interactions, as well as the impact of the effects of power supply droop, ground bounce and crosstalk between adjacent signals, not only on the IC package level, but at the computer system level.