System and method for actively correcting offset drift and wire bonder

Abstract

The invention provides a system and a method for actively correcting an offset drift and a wire bonder. Collimating mirrors, a spectroscope, a coaxial-light emitter and a back reflector are arranged reasonably; a difference value of different positions, on a target surface of an imaging system detector, of a metal ball formed by a capillary tip at different time points during work is determined as offset drift amount of the distance between the capillary and the imaging system; and a parameter about the distance between the capillary and the imaging system is corrected according to the offset drift amount. The offset drift amount of the distance between the capillary and the imaging system can be accurately measured and corrected in real time, so that welding accuracy of the wire bonder is guaranteed, and rate of finished chip is increased. Besides, the system for actively correcting the offset drift and the wire bonder are simple in structures, low in cost and convenient to modularize.

Description

technical field [0001] The invention relates to the technical field of semiconductor device production technology, in particular to an offset drift active correction system, method and wire bonding machine. Background technique [0002] The electrical performance of semiconductor devices, such as integrated circuit chips, is generally achieved by bonding the chip to the lead frame, and then through wire bonding or flip-chip welding (connecting the solder joints of the chip to the pins of the material frame). [0003] The process of wire bonding is to first place gold wires to the pads on the chip, and then connect the pads to the leads of the lead frame. When all the solder joints and pins are bonded together, they are packaged to form an integrated circuit chip. Usually the package is a ceramic package or a plastic package. Common chips generally have hundreds or even thousands of solder joints that need to be connected. [0004] There are many types of wire bonding equi...

AI Technical Summary

Problems solved by technology

[0007] However, the existing technical solutions for measuring and correcting the distance offset drift between the chopper and the imaging system 2 have low measurement accuracy and sensitivity in specific applications, and the system structure is complicated, difficult to install, and high in cost.

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