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Resin sheet for attaching hard surface plate, laminate using same and application thereof

A flat board and resin sheet technology, applied in the field of resin sheets for hard flat board lamination, can solve problems such as image quality degradation, internal scattering, lamination, etc., and achieve the effect of good bubble recurrence resistance

Active Publication Date: 2015-04-15
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technology has the following problems: the air gap layer between the display and the protective plate causes internal scattering, resulting in lower image quality
[0011] However, the double-sided adhesive tape of Patent Document 2 can be bonded without leaving air bubbles even if there is a slight level difference when bonding a flat plate and a deformable film, but when bonding the flat plates to each other, , That is, when the non-deformable surfaces are bonded to each other, they cannot be bonded while expelling air bubbles, so air bubbles are mixed into the bonding surface, and it is difficult to further fully adapt to the height difference

Method used

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  • Resin sheet for attaching hard surface plate, laminate using same and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] Resin solution 1 was applied to a heavy release sheet [manufactured by Lintec, product name "SP-PET75T103-1"], and heated at 120°C for 2 minutes to form a 50 μm-thick step surface bonding layer on the heavy release sheet (hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, the resin solution 2 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level surface with a thickness of 50 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin sheet formed of two...

Embodiment 2

[0109] Apply the resin solution 3 to a heavy release sheet [manufactured by Lintec, product name "SP-PET75T103-1"], and heat at 120°C for 2 minutes to form a 50 μm-thick step surface bonding layer on the heavy release sheet (hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, resin solution 4 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level surface with a thickness of 50 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin sheet formed of two resin l...

Embodiment 3

[0112] Resin solution 5 was coated on a heavy release sheet [manufactured by Lintec Corporation, product name "SP-PET75T103-1", and heated at 120° C. for 2 minutes to form a 60-μm-thick step bonding layer on the heavy release sheet ( Hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, the resin solution 2 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level difference surface with a thickness of 55 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin she...

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Abstract

The invention relates to a resin sheet for attaching hard surface plates, a laminate using the same and an application thereof. The resin sheet is provided, and thus two hard surface plates can be respectively attached to two sides of the resin sheet with good elevation difference adaptability and bubble recurrence resistance. The resin sheet for attaching hard surface plates is used for respectively attaching two hard surface plates to two sides of the resin sheet, and is characterized in that at least 3 resin layers are provided; 2 resin layers connected with the hard surface plates have a storage modulus of 0.05-0.11 MPa at a temperature of 23 DEG C, and a storage modulus of 0.01-0.09 MPa at a temperature of 80 DEG C; and at least one layer of the intermediate layers not connected with the attached objects has a storage modulus of 0.08-0.11 MPa at a temperature of 80 DEG C.

Description

technical field [0001] The present invention relates to a resin sheet for bonding a hard flat panel, a laminate using the same, and uses of the laminate. [0002] More specifically, the resin sheet for laminating rigid flat panels is used to separate two rigid flat panels in a manner that is adaptable to height differences (level differences) and does not cause bubble recurrence (hereinafter sometimes referred to as "bubble recurrence resistance"). Attached to both sides of the resin sheet. [0003] In addition, the laminate and the application of the laminate more specifically relate to a laminate obtained by laminating two hard flat plates with the resin sheet interposed therebetween, and a portable information terminal device and a capacitor obtained by using the laminate as a component. type touch panel device. Background technique [0004] Conventionally, in order to bond the display body of a mobile device or a monitor to a protective plate, a frame-like bonding is g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00B32B27/30
CPCB32B27/08B32B2307/51B32B2307/732B32B2457/208B32B7/022G06F3/041G06F3/0412G06F3/044
Inventor 江嶋由多加吉延毅朗本乡有记
Owner LINTEC CORP