Resin sheet for attaching hard surface plate, laminate using same and application thereof
A flat board and resin sheet technology, applied in the field of resin sheets for hard flat board lamination, can solve problems such as image quality degradation, internal scattering, lamination, etc., and achieve the effect of good bubble recurrence resistance
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Embodiment 1
[0106] Resin solution 1 was applied to a heavy release sheet [manufactured by Lintec, product name "SP-PET75T103-1"], and heated at 120°C for 2 minutes to form a 50 μm-thick step surface bonding layer on the heavy release sheet (hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, the resin solution 2 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level surface with a thickness of 50 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin sheet formed of two...
Embodiment 2
[0109] Apply the resin solution 3 to a heavy release sheet [manufactured by Lintec, product name "SP-PET75T103-1"], and heat at 120°C for 2 minutes to form a 50 μm-thick step surface bonding layer on the heavy release sheet (hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, resin solution 4 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level surface with a thickness of 50 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin sheet formed of two resin l...
Embodiment 3
[0112] Resin solution 5 was coated on a heavy release sheet [manufactured by Lintec Corporation, product name "SP-PET75T103-1", and heated at 120° C. for 2 minutes to form a 60-μm-thick step bonding layer on the heavy release sheet ( Hereinafter referred to as layer A-1). Furthermore, the peeling surface of the light release sheet [manufactured by Lintec Corporation, product name "SP-PET3801"] was laminated on A layer-1, and the resin layer sandwiched between two peeling sheets was produced. Separately, the resin solution 2 was applied to a light release sheet [manufactured by Lintec Corporation, product name "SP-PET382120"], and heated at 120°C for 2 minutes to form a non-level difference surface with a thickness of 55 μm on the light release sheet. Layer (hereinafter referred to as Layer B). Furthermore, layer A-1 and layer B exposed by peeling off the light release sheet of the resin layer sandwiched between the two release sheets were bonded together to obtain a resin she...
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Abstract
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