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Arrangement and production method with at least one item to be packaged and transport packaging

A technology for arranging structures and items, applied in the field of arranging structures and manufacturing with at least one item to be packaged and transport packaging, capable of solving problems such as damage to the middle layer

Active Publication Date: 2016-08-17
SEMIKRON ELECTRONICS GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage in this case is that the middle layer and / or the cover layer are mechanically damaged when opening such a package, since parts of them adhere to the cover film

Method used

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  • Arrangement and production method with at least one item to be packaged and transport packaging
  • Arrangement and production method with at least one item to be packaged and transport packaging
  • Arrangement and production method with at least one item to be packaged and transport packaging

Examples

Experimental program
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Effect test

Embodiment Construction

[0027] figure 1 Two arrangements 1, 1' according to the invention, each with a transport packaging 2 and a plurality of power semiconductor modules 5, are shown in three-dimensional illustration. A housing 50 and a plurality of connection elements 60 are each represented by the power semiconductor modules 5 . Utilize their invisible bottom element 40 (see figure 2, here a metal substrate), these power semiconductor modules 5 are connected to the plastic layer 130 in a two-dimensional matrix. The power semiconductor modules 5 are arranged on the first main face 100 of the cover layer 10 of the respective transport packaging 2 in such a way that the bottom element 40 (see figure 2 ) directly above it.

[0028] The intermediate layer 20 is arranged with its second main surface 210 on this plastic layer 130 in a non-adhesive and thus connected manner. The intermediate layer 20 has a plurality of cutouts 230 which are each assigned to a power semiconductor module 5 . In thi...

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PUM

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Abstract

The arrangement (1) has a covering layer (10) formed with a main surface (100) facing towards an object (5) i.e. power semiconductor module, to be packed. An intermediate layer (20) is arranged on a plastic layer (130) that is arranged in the main surface, and the covering layer comprises openings on the plastic layer. A covering film not fully covers a part of the object that lies on the plastic layer and lies in a housing (50). The film is adhesively connected with a main surface (200) of the intermediate layer and with the plastic layer in a region of an auxiliary surface (140). The covering layer and / or intermediate layer consist of paperboard and cardboard. An independent claim is also included for a method for forming an arrangement for transporting an object.

Description

technical field [0001] The invention describes an arrangement for transporting at least one item to be packaged, usually ex-factory, and a production method for such an arrangement. Items to be packaged within the meaning of this document are in particular electrotechnical products and in this case especially power semiconductor modules. In the following, the invention is therefore described with the aid of such a power semiconductor module, without limiting the generality of the invention. In this case, preferably a plurality of power semiconductor modules are arranged in a one-dimensional or two-dimensional matrix in the transport packaging. Background technique [0002] In principle, a large number of different transport packages are known for power semiconductor modules, such as simple cardboard box packaging or plastic packaging with a base body and a cover. So-called skin packaging is known from the packaging of goods for end consumers. Simple cardboard packaging ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D73/00B65D85/62
CPCB65D75/327B65D75/367B65D2575/3245
Inventor 斯特凡·斯塔罗韦茨基斯特凡·门戈斯多夫
Owner SEMIKRON ELECTRONICS GMBH & CO KG