LED package with efficient, isolated thermal path

Abstract

Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and / or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Patent Application Serial No. 12 / 853,812, filed August 10, 2010, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The subject matter disclosed herein relates generally to packaging of light emitting diodes (LEDs). More specifically, the subject matter disclosed herein relates to the packaging of LEDs at low cost with efficient, thermally isolated paths. Background technique [0004] Light emitting devices such as light emitting diodes (LEDs) are typically packaged within surface mount device (SMD) housings. These housings are often made of plastic and may be referred to as Plastic Leaded Chip Carriers (PLCCs). SMD housings typically feature an LED chip connected to a plurality of metal leads formed by a lead frame, and may optionally include a heat sink. Current packages include metal lead portions that extend outside the pac...

AI Technical Summary

Problems solved by technology

For this reason, the ability of the metal leads to dissipate heat from the LED is limited

This limits the amount of electricity that can be sent to the LED chip and thus the amount of light that can be produced by the LED package

This design is similar to the design shown in FIGS. 1A and 1B in that the outer portions 56 and 58 of the first and second metal leads 46 and 48 thereby increase the footprint, include a difficult bending step for the outer portions, and increase the footprint. Increases the amount of metal necessary to manufacture the package, which in turn increases cost and reduces available space on the PCB

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