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Method of making film/sheet laminate structure

A laminated structure and film technology, applied in the direction of lamination, lamination devices, chemical instruments and methods, etc., can solve the problems of reduced tear resistance expansion, affecting packaging tear resistance, etc.

Active Publication Date: 2017-05-31
ILLINOIS TOOL WORKS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In addition, it was also found that the level of adhesion of the film to the paperboard substrate can affect the tear resistance of the package
In particular, it has been found that if the adhesion of the film to the paperboard substrate is too great, the tear propagation resistance is reduced

Method used

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  • Method of making film/sheet laminate structure
  • Method of making film/sheet laminate structure
  • Method of making film/sheet laminate structure

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Embodiment Construction

[0019] While the invention may be embodied in various forms of embodiments, currently preferred embodiments are shown and described in the accompanying drawings, it is to be understood that this disclosure is to be understood as exemplifying the invention and is not intended to limited to the specific embodiments shown.

[0020] figure 1 An exemplary film / sheet laminate 10 is shown. Film / panel laminate (or film / panel laminate) 10 consists of a base (or base layer) 12 and a film layer 14 that are adhered to each other. An extrudate or adhesive 16 is disposed between the film 14 and the substrate 12 . Thus, the laminate structure 10 may be constructed by extrusion, adhesive lamination, or a combination of extrusion and adhesive lamination. The laminate structure 10 further includes a heat seal layer 18 on the film 14 , the heat seal layer 18 being the opposite of the extrudate 16 / substrate layer 12 . The heat seal layer 18 is arranged to fold the laminate structure 10 over i...

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Abstract

A method for making a film / board laminate for use in pilfer resistant packaging includes providing a non-treated paperboard substrate, adhering a single ply of an oriented film to the substrate, the oriented film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees such that a film to substrate adhesion is about 0.5 pli to 1.4 pli, and applying a heat seal layer to the film.

Description

Background technique [0001] Packaging materials are used in various ways in daily life. As early as the 1870s, corrugated packaging materials were used to protect fragile and valuable items during packing and handling. The various paper, cardboard and fiberboard materials used to make early corrugated materials are still used today in their basic form and / or in slightly improved forms. [0002] Currently, the use of packaging serves many purposes. In many cases, the packaging must also act as a pilfer deterrent in addition to its traditional protective function. This is especially true for smaller, more expensive items. [0003] Although conventional packaging such as cardboard or corrugated board with various coatings provides good protection, they do not have a substantial level of pilfer resistance. As such, more rugged, tear-resistant materials have been incorporated into packaging materials to meet today's needs. [0004] A packaging material that includes a tear res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/02B32B37/12B32B27/10
CPCB32B7/12B32B27/10B32B27/32B32B2307/31B32B2307/516B32B2307/5825B32B2553/00B65D73/0078B65D73/0085B65D73/0092
Inventor 迈克尔·J.·伦奇吉小罗纳德·C.·霍法特
Owner ILLINOIS TOOL WORKS INC