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Wafer level camera module with snap-in latch

A snap-in, chip-level technology applied in the field of image sensors that can solve problems such as increased production costs

Active Publication Date: 2013-10-23
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result of low yields is increased production costs

Method used

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  • Wafer level camera module with snap-in latch
  • Wafer level camera module with snap-in latch
  • Wafer level camera module with snap-in latch

Examples

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Embodiment Construction

[0017] As will be shown, methods and apparatus are disclosed that provide an example of a wafer-level camera module with a snap-in latch. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one of ordinary skill in the art that such specific details need not be employed to practice the present invention. In other instances, well-known materials or methods have not been described in detail in order not to obscure the present invention.

[0018] Reference throughout this specification to "one embodiment," "an embodiment," "an example," or "an example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one aspect of the present invention. Examples. Thus, appearances of the phrases "in one embodiment," "in an embodiment," "an example," or "an example" in various places t...

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Abstract

An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube.

Description

[0001] Cross References to Related Applications [0002] This application is related to No. ## / ## of the March 30, 2012 application entitled "Wafer Level Camera Module With Protective Tube" and assigned to the assignee of this application Co-pending applications No. #,### are related. technical field [0003] The present invention generally relates to image sensors. More specifically, embodiments of the present invention relate to wafer level camera modules. Background technique [0004] A wafer-level camera module is a camera module that has a small footprint and can be used in applications such as mobile phones, notebook computers, tablet computers, and the like. A wafer-level camera module includes optics for focusing an image and an image sensor for sensing the image. To capture high quality images, the optics of the camera module typically include several lenses singulated from glass wafers and / or spacers. The lenses are stacked in a lens stack. The lens stack is ...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N5/225H04N23/50Y10T29/49826
Inventor 凯文·嘉凯·梁林文华
Owner OMNIVISION TECH INC
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