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Housing for high-power light-emitting diodes

A shell and base technology, applied in the field of manufacturing the shell, can solve the problems, such as the LED is not fully sealed and packaged, the electrical connection is degraded, etc.

Active Publication Date: 2013-12-04
SCHOTT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, LEDs positioned within such housings are not sufficiently hermetically encapsulated from possible influences due to the surrounding environment
This can lead to degradation of materials, surfaces and / or electrical connections
In addition, the thermal stability of the resin has proven to be problematic for optoelectronic devices with higher output power, such as 5W LEDs

Method used

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  • Housing for high-power light-emitting diodes
  • Housing for high-power light-emitting diodes
  • Housing for high-power light-emitting diodes

Examples

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Embodiment Construction

[0089] FIGS. 1.a to 1.d show a first embodiment of a two-layer or at least two-layer housing 100 with a single, here first recess 11 in the base body 10 . A connecting body 30 is arranged on the base body 10 . Base body 10 and connecting body 30 are bonded to one another via glass layer 20 .

[0090] The base body 10 has an upper side 10 a , a lower side 10 b and a peripheral surface 13 or edge 13 as well as a central axis 10 c. In the example shown, the base body 10 has a square cross section. Its upper side 10 a has a first recess 11 , for example provided by a recess 11 . The depression is preferably arranged centrally in the base body 10 and / or coaxially with the base body 10 . The first depression 11 here has a circular, preferably perfectly circular cross section. However, it can also be rectangular, preferably square. The diameter of the first recess 11 preferably increases continuously from the bottom of the first recess 11 toward its upper side. The first depres...

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PUM

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Abstract

The invention relates to a housing for optoelectronic components, such as LEDs, and to a method for producing said housing. The housing is a housing for receiving a functional element, in particular an LED, consisting of a main part. The main part comprises an upper face, which defines a mounting region for at least one optoelectronic functional element at least in some sections such that the main part forms a heat sink for at least one optoelectronic functional element, and the main part also comprises a lower face and a casing. The housing also consists of at least one connecting part for at least one optoelectronic functional element, said connecting part being connected to the main part at least by means of a glass layer. The at least one connecting part lies on the casing side of the main part and extends along the periphery of the main part at least along some sections, and at least the upper face of the main part has at least one first depression with a base that provides the mounting region for at least one optoelectronic functional element.

Description

technical field [0001] The invention relates to a housing for an optoelectronic device, such as an LED, and to a method for producing said housing. Background technique [0002] Currently, so-called "high-power light-emitting diodes" (LEDs) are encapsulated in plastic and resin structures, that is to say organic housings, as a general standard. However, LEDs positioned within such housings are not sufficiently hermetically encapsulated from possible influences due to the surrounding environment. This can lead to degradation of materials, surfaces and / or electrical connections. Furthermore, the thermal stability of the resin has proven to be problematic for optoelectronic devices with higher output powers, such as 5W LEDs. [0003] A technique for overcoming this drawback is described in patent application WO 2009 / 132838 A1. The content of this patent application is fully incorporated by reference into the present patent application. An essentially completely inorganic ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/642H01L33/483H01L2224/48091H01L33/647H01L33/48H01L33/64H01L2924/181H01L2224/49109H01L2924/00014H01L2924/00012
Inventor 罗伯特·黑特勒马蒂亚斯·林特
Owner SCHOTT AG