An anti-copper column pressure leakage device and automatic copper column pressing machine

Abstract

The invention discloses a device for preventing a copper cylinder from failing to be pressed and an automatic machine for pressing the copper cylinder. A sensor can be used for detecting whether the copper cylinder is on a copper cylinder moving sheet, detection on whether the copper cylinder fails to be pressed can be conveniently realized through displacement distance difference generated by the copper cylinder moving sheet, and the copper cylinder can be supplemented at the position so as to be pressed, so that the production quality is improved, and the time for replenishing the copper cylinder in following steps is shortened. The device for preventing the copper cylinder from failing to be pressed comprises a detection module and a feed module, wherein the detection module comprises the sensor, a regulation ruler, a regulation ruler base, a position regulation base and a slide rail, the sensor is installed on the position regulation base and is used for detection the position of a spring thimble, the regulation ruler is installed on the regulation ruler base and is used for regulating the position of the sensor, one end of the regulation ruler is contacted with the position regulation base, and the position regulation base is installed on the regulation ruler base through the slide rail and is used for regulating the sensor through the regulation ruler.

Description

technical field [0001] The invention relates to the field of machinery, in particular to a copper column pressure leakage prevention device and an automatic copper column pressing machine. Background technique [0002] The automatic copper pillar pressing machine is a machine used in the assembly of notebooks or mobile phones to automatically press copper pillars into the copper pillars in the notebook case or mobile phone case. [0003] The process of pressing the copper column into the notebook case or mobile phone case is as follows: After the copper column is arranged on the vibrating plate, the copper column will be transported to the position of the pressing punch of the copper column pressing machine head, and the copper column will be pressed by the pressing punch. The column is pressed into the notebook case or mobile phone case, but due to the existence of the copper column and copper filings, it is easy to cause the transportation track of the copper column to be ...

AI Technical Summary

Problems solved by technology

[0003] The process of pressing the copper column into the notebook case or mobile phone case is as follows: After the copper column is arranged on the vibrating plate, the copper column will be transported to the position of the pressing punch of the copper column pressing machine head, and the copper column will be pressed by the pressing punch. The column is pressed into the notebook case or mobile phone case, but due to the existence of the copper column and copper filings, it is easy to cause the transportation track of the copper column to be blocked, and then the copper column does not exist at the position of the pressing punch when the pressing punch is pressed down. That is, the copper pillars of the notebook case or mobile phone case are not pressed into the copper pillars, resulting in serious quality problems

[0004] However, as far as the current copper column pressing machine is concerned, because the copper column is sent from the heating block to the position of the pressing punch by the push piece, it is difficult to add a sensor for checking whether the copper column has reached the position, and then the pressing punch When the head presses the copper column to the position of the copper column, it is difficult to ensure that the copper column must be pressed into the copper column of the notebook case or mobile phone case, so there is a serious hidden danger in production quality

The existing solution in the industry is: first use a vertical steel rod with a vacuum suction port in the middle to suck up the copper column vertically, then move the copper column to the position of the pressing punch, and use an infrared sensor to sense whether the copper column has reached, It can complete the function of detecting the pressed copper pillar, but when there are copper chips on the surface of the copper pillar, the suction force when the vertical steel rod is adsorbed is not enough, and the copper pillar is easy to fall when the copper pillar is moved to the position of the pressing punch. falling problem

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