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Method for inspecting contamination of solder printing machine and mask of solder printing machine

A technology for printing presses and solders, which is applied to general parts of printing machinery, printing presses, rotary printing presses, etc., and can solve the problems of mistaking scratches as solder, difficult masking, and contamination inspection.

Active Publication Date: 2017-07-07
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the above-mentioned conventional mask contamination inspection method, if there is a scratch on the surface of the mask, the scratch may be mistaken for solder in the obtained image, and it is difficult to perform high-precision masking. The turbidity check for such problems

Method used

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  • Method for inspecting contamination of solder printing machine and mask of solder printing machine
  • Method for inspecting contamination of solder printing machine and mask of solder printing machine
  • Method for inspecting contamination of solder printing machine and mask of solder printing machine

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Embodiment Construction

[0039] Hereinafter, embodiments of the present invention will be described with reference to the drawings. exist figure 1 , figure 2 and image 3 Among them, the solder printer 1 is a device that repeatedly executes a series of processes including loading and holding operations of the substrate 2, transfer operation of the solder Hd to the held substrate 2, and unloading operation of the substrate 2 on which the solder Hd has been transferred.

[0040] exist figure 1 , figure 2 and image 3 Among them, the solder printing machine 1 is provided with: a substrate holding and moving unit 4, which is provided on a base 3 as a substrate holding portion for carrying, positioning, and holding a substrate 2 and a substrate moving portion for moving the held substrate 2; The mold 5 is in contact with the substrate 2 held by the substrate holding and moving unit 4 ; Together, the solder Hd is transferred to the substrate 2; the camera unit 7 is horizontally movable in the upper ...

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Abstract

An object of the present invention is to provide a solder printer and a method for inspecting contamination of a mask of a solder printer capable of inspecting contamination of a mask with high precision even when there are scratches on the surface of the mask. Taking the area including the pattern hole (5a) of the mask (5) as the inspection site (S), by photographing the inspection site in a state where the inspection site is illuminated from a first direction relative to the mask hole , so as to obtain a first image (GZ1) that can distinguish the solder (Hd) attached around the pattern hole and the inner area of ​​the solder from other areas, and in a different direction from the first direction relative to the mask The inspection site is photographed under illumination from the second direction to obtain a second image ( GZ2 ) in which the region of solder in the inspection site can be distinguished from other regions. Then, the state of the solder of the mask is detected by acquiring a superimposed image ( GZ3 ) obtained by superimposing the two images ( GZ1 , GZ2 ).

Description

technical field [0001] The present invention relates to a solder printer for printing solder on a substrate through a pattern hole of a mask, and a method for inspecting contamination of a mask of the solder printer. Background technique [0002] The solder printing mechanism is such that a mask having a patterned hole is brought into contact with a substrate, and the squeegee is slid on the mask to scrape up the solder on the mask, thereby transferring the solder to the substrate through the patterned hole. Thereafter, the substrate is separated from the mask, and solder is printed on the substrate. [0003] In this type of solder printing machine, whenever solder printing is performed on the substrate, the solder adheres to the pattern hole of the mask, and as the solder adheres to the pattern hole, the opening area of ​​the pattern hole gradually decreases. Printing accuracy of the solder on the substrate deteriorates. Therefore, it is known that a mask after printing s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F33/00
Inventor 水谷直喜孟贤男
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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