POP paster device and chip removing jig

Abstract

The invention discloses a POP paster device which comprises a turntable, a scraper arranged above the turntable and a chip removing jig. The chip removing jig comprises a transverse frame and multiple blocking strips, wherein the blocking strips are installed on the transverse frame at intervals, one end of each blocking strip away from the transverse frame is in contact with the turntable surface and opposite to the turntable in rotation direction. The chip removing jig is arranged on the turntable, once a chip drops into the turntable, the chip rotates to the position of the chip removing jig with the turntable, the blocking strips block the chip, the chip can slip onto the blocking strips under the driving of the turntable and break away from the turntable and is prevented from rotating to the scraper position and influencing normal flowing of a bottom layer scaling powder, follow-up chips can dip in the scaling powder, and the poor welding problem caused by the fact that upper-layer chips drop is solved. In addition, the blocking strips are arranged on the transverse frame at intervals, the scaling powder can pass through the separation positions, and normal flowing of the scaling powder is not influenced. The invention further discloses the chip removing jig.

Description

technical field [0001] The invention relates to a POP patching device and a chip removal jig thereof. Background technique [0002] At present, the specific process of POP (Package on Package) packaging device mounting process is as follows: first, put flux into the turntable set on the material rack of SMT (Surface Mounted Technology) placement machine, and use a scraper to scrape the flux flat, The SMT placement machine picks up the upper chip and moves it to the top of the turntable, so that all the solder balls under the upper chip are dipped in flux, and then puts the upper chip on the bottom chip, so that the upper chip and the bottom chip are bonded to each other, and finally Send the bonded chip into the reflow oven for soldering. With the melting of the solder balls, high-quality tin alloy welding is formed between the upper chip and the bottom chip of the POP packaged device. [0003] In the above process, the upper chip often falls off when dipped in flux. After ...

AI Technical Summary

Problems solved by technology

[0004] Based on this, the present invention overcomes the defects of the prior art and provides a POP placement device, which can effectively avoid the problem of poor soldering caused by chip falling off during the placement process.

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