Unlock instant, AI-driven research and patent intelligence for your innovation.

Movable insulation baffle

An insulating baffle and mobility technology, which is applied in the direction of logic controllers, printed circuits, coupling devices, etc. for automation/industrial process control, can solve the problem of reducing the assembly density of electronic components, and achieve the expansion of pores and/or climbing The effect of electrical distance

Active Publication Date: 2017-06-23
PHOENIX CONTACT GMBH & CO KG
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, this means that a larger gap is required between the substrates carrying potentials with different levels, which in turn means that a larger surface area is required and thus the packing density of electronic components is reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Movable insulation baffle
  • Movable insulation baffle
  • Movable insulation baffle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] figure 1 Shown is a built-in housing 1 for placement on a support rail not shown, containing a printed circuit board 2 placed inside the housing 1, and insulating barriers 3 (which are also shown in figure 2 with image 3 ), which also contains electronic assemblies 4 (they are also shown in the Figure 2 to Figure 4 middle).

[0032] In the present example, the electronic assembly 4 is designed as a baseband, into which plug connectors, not shown, which correspond to the baseband 4 , can be inserted. The electrical contacts 6 of the electronic assembly 4 are connected via solder terminals 5 to the wiring of the printed circuit board 2 , not shown.

[0033] In order to increase the isolation distance between the two potentials of the printed circuit board 2, that is, the isolation distance between the solder terminals 5' and 5" marked in quotation marks, the printed circuit board 2 has a gap 7, and the insulating barrier 3 Inserted into notch 7, such as figure 2 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a device for increasing the insulation coordination between at least two potentials on a printed circuit board (2), said device comprising a printed circuit board (2) and an insulating barrier (3), wherein The printed circuit board (2) has a gap (7) between the potentials, and the insulating barrier (3) is placed on the printed circuit board (2) so as to be able to move in the gap (7), and the insulating barrier (3) is placed on the printed circuit board (2). 3) It is designed such that the separation distance between two potentials can be increased by moving the insulating barrier (3) relative to the printed circuit board (2). This arrangement offers the possibility of obtaining a high packing density on the printed circuit board (2).

Description

technical field [0001] The invention relates to a device for increasing the insulation coordination between at least two potentials on a printed circuit board. The invention also relates to a built-in housing for mounting on a support rail, the housing having means placed inside it. Finally, the invention relates to a method for increasing the insulation coordination between at least two potentials on a printed circuit board. Background technique [0002] Through the prior art, we know that electronic components such as base strips can be provided on the printed circuit board, which are electrically connected to the traces of the printed circuit board through soldering terminals and can provide plug connectors corresponding to the base strip electrical connections. Such a printed circuit board can then be inserted into a snap-in housing, which can be fastened to the support rails of the distribution box. [0003] Assuming a similar level of potential on the printed circui...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/14H01R9/26H05K5/02H05K1/02H01R13/53
CPCH01R9/26H05K1/0256H05K5/0247H05K7/1469H05K2201/0761H05K2201/09063H05K2201/10189Y10T29/49124H01R12/71H05K1/0306H05K3/0011
Inventor 弗兰克·贝斯特马尔科·泽利希
Owner PHOENIX CONTACT GMBH & CO KG