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Displaceable insulation barrier

A technology of insulating baffles and insulating coordination, applied in the direction of logic controllers, printed circuits, coupling devices, etc. for automation/industrial process control, can solve the problems of reducing the assembly density of electronic components, and achieve the expansion of pores and/or creepage. The effect of electrical distance

Active Publication Date: 2014-12-10
PHOENIX CONTACT GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, this means that a larger gap is required between the substrates carrying potentials with different levels, which in turn means that a larger surface area is required and thus the packing density of electronic components is reduced

Method used

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  • Displaceable insulation barrier
  • Displaceable insulation barrier
  • Displaceable insulation barrier

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0031] figure 1 Shows an embedded housing 1 for placement on a support rail not shown, which contains a printed circuit board 2 and an insulating baffle 3 placed in the housing 1 (they are also shown in figure 2 with image 3 Middle), which also contains electronic components 4 (they are also shown in Figure 2 to Figure 4 in).

[0032] In the current example, the electronic component 4 is designed as a base band, into which a plug connector not shown can be inserted, and the plug connector corresponds to the base band 4. The electrical contacts 6 of the assembly 4 are connected to the wiring of the printed circuit board 2 not shown through solder terminals 5.

[0033] In order to increase the isolation distance between the two potentials of the printed circuit board 2, that is, the isolation distance between the solder terminals 5'and 5" marked with quotation marks, the printed circuit board 2 has a gap 7 and an insulation baffle 3 Insert into gap 7 like figure 2 with 3 As show...

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PUM

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Abstract

The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising said printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is arranged displaceably through the opening (7) on the printed circuit board (2) in such a way that the insulation section between the two electric potentials can be enlarged by displacing the insulation barrier (3) in relation to the printed circuit board (2). The arrangement enables a high packing density on the printed circuit board (2).

Description

Technical field [0001] The invention relates to a device for increasing the insulation coordination between at least two potentials on a printed circuit board. The invention also relates to an embedded housing for mounting on a support rail, the housing having a device placed inside it. Finally, the invention relates to a method for increasing the insulation coordination between at least two potentials located on a printed circuit board. Background technique [0002] Through the existing technology, we know that electronic components such as a base strip can be provided on a printed circuit board, which are electrically connected to the traces of the printed circuit board through solder terminals and can provide a plug connector corresponding to the base strip Electrical connection. This printed circuit board can then be inserted into the embedded housing, which can be fixed on the support rail of the distribution box. [0003] Assuming that the potentials on the printed circuit...

Claims

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Application Information

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IPC IPC(8): H05K7/14H01R9/26H05K5/02H05K1/02H01R13/53
CPCH05K2201/0761H05K2201/09063H05K7/1469H05K2201/10189H01R9/26H05K1/0256H05K5/0247Y10T29/49124H01R12/71H05K1/0306H05K3/0011
Inventor 弗兰克·贝斯特马尔科·泽利希
Owner PHOENIX CONTACT GMBH & CO KG