Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof

A technology of ultrasonic sensor and structural capacitance, which is applied in the direction of ultrasonic/sonic/infrasonic Permian technology, ultrasonic/sonic/infrasonic diagnosis, ultrasonic/sonic/infrasonic image/data processing, etc., which can solve the problem of low receiving sensitivity and affecting blood vessels Endoscopic imaging detects problems such as imaging range, imaging quality, and small scanning area of ​​the circular diaphragm to achieve the effect of expanding the imaging range, preventing stress concentration effects, and increasing the scanning area

Inactive Publication Date: 2015-05-20
TIANJIN UNIV
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  • Application Information

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Problems solved by technology

[0007] Based on the above analysis, the circular array design of the capacitive micro-ultrasonic sensor using the circular membrane secondary array as the working unit still has defects, such as the small scanning area and the low receiving sensitivity of the circular diaphragm affect the imaging range of endoscopic imaging detection. and image quality

Method used

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  • Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof
  • Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof
  • Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof

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Embodiment 1

[0040] The present invention proposes a capacitive micro-ultrasonic sensor annular vascular endoscopic imaging array with an elliptical membrane secondary array as the working unit, see Figure 4 , comprising: an elliptical membrane secondary array 16,

[0041] Among them, see Figure 5 The elliptical membrane secondary array 16 further includes: an elliptical diaphragm 10, an elliptical membrane secondary array top electrode 11, an elliptical membrane secondary array top electrode leading out a PAD 12, and the elliptical membrane secondary array 16 is arranged by 16 elliptical diaphragms 10. 4*4 array, the long and short axes of 16 elliptical diaphragms 10 point in the same direction. In addition, the elliptical diaphragms 10 are arranged at equal intervals in the long axis direction with a pitch of 75um, and are arranged at equal intervals in the short axis direction with a pitch of 60um. The top electrodes 11 of the elliptical film sub-array are distributed above the elli...

Embodiment 2

[0054] The present invention needs to control the circuit system related to sending and receiving ultrasonic waveforms, and an elliptical diaphragm capacitive micro-ultrasonic sensor unit needs to apply a bias DC voltage to send and receive ultrasonic waves. When the unit is in the transmitting state, an additional AC pulse excitation is applied between the top electrode 11 of the elliptical membrane secondary array and the silicon substrate 15. Under the simultaneous action of the DC bias voltage and the pulse excitation, the elliptical diaphragm 10 vibrates and sends out pulses. Signal. When the unit is in the receiving state, the elliptical diaphragm 10 generates an AC current signal under the action of the ultrasonic wave, which is received by the circuit detection system to judge the amplitude and phase information of the ultrasonic wave for information processing.

[0055] The circuit system of the ring array of capacitive micro-ultrasonic sensors with elliptical membran...

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Abstract

The invention discloses a capacitance type micro-ultrasonic sensor ring array with an oval diaphragm unit structure and a circuit system thereof. The work unit of the ring array is an oval diaphragm secondary array. The oval diaphragm secondary array comprises an oval vibrating diaphragm, oval diaphragm secondary array top electrodes and oval diaphragm secondary array top electrode outlet PADs, wherein the oval diaphragm secondary array top electrodes are distributed above the oval vibrating diaphragm, and each oval diaphragm secondary array top electrode is connected with the corresponding oval diaphragm secondary array top electrode outlet PAD. An FPGA controls a transmitting end to scan each device unit and send phase-controlled pulse signals, and focusing and translation of transmitted acoustic waves of the capacitance type micro-ultrasonic sensor ring array with the oval diaphragm unit structure are achieved through a phased array. A receiving device receives ultrasonic echo signals which are then read into an FPGA memory through a pre-amplifier and an analog to digital conversion module (AD), and imaging is conducted according to the phase and amplitude of each received signal. According to the capacitance type micro-ultrasonic sensor ring array with the oval diaphragm unit structure, the sweep area of the imaging ring array is increased and the receiving sensitivity of an oval vibrating diaphragm is improved.

Description

technical field [0001] The present invention relates to research on capacitive micro-ultrasonic sensors in the field of micro-electro-mechanical systems (Micro-Electro-Mechanical System, hereinafter referred to as MEMS), and designs a capacitive micro-ultrasonic sensor ring array and electrical system. Background technique [0002] In recent years, with the vigorous development of MEMS technology, the research of capacitive micro-ultrasonic sensors using MEMS technology has become a hot spot, which has corresponding application value in medical endoscopic detection imaging, therapeutic ultrasound, microfluidic detection, and industrial non-destructive. The capacitive ultrasonic sensor inherits the characteristics of small volume, high precision and high degree of integration of MEMS. At the same time, compared with piezoelectric products in the MEMS field, capacitive micro-ultrasonic sensors have the following characteristics: First, the processing technology of capacitive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/08
CPCA61B8/08A61B8/14A61B8/4488
Inventor 张慧张雯石建超靳世久
Owner TIANJIN UNIV
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