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Production method for printed wiring board and printed wiring board produced by said method

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as energy consumption, time consumption, economy, and productivity decline, and achieve the prevention of abnormal precipitation of plated metal, prevention of The effect of reduced productivity

Active Publication Date: 2015-08-12
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] A substrate with a large size (for example, 500×600mm) has the following problems: it is difficult to remove useless metal copper and the like with good precision by grinding, etching, etc., and additional equipment is required, which consumes additional energy and takes additional time. etc., leading to a significant decline in economy and productivity, etc.

Method used

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  • Production method for printed wiring board and printed wiring board produced by said method
  • Production method for printed wiring board and printed wiring board produced by said method
  • Production method for printed wiring board and printed wiring board produced by said method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0025] figure 1 It is a cross-sectional view showing the printed circuit board according to the first embodiment of the present invention.

[0026] like figure 1 As shown, the printed circuit board 1 of this embodiment includes: a first resin layer 2, a conductor circuit 3 formed on the first resin layer 2, and a second resin formed on the first resin layer 2 to cover the conductor circuit 3 layer 4 , via holes 5 and channels 6 formed in the second resin layer 4 , and metal layers 7 formed in the via holes 5 and channels 6 .

[0027] The first resin layer 2 functions as a base substrate of the printed circuit board 1 and is formed of an electrically insulating resin material. The materials that can be listed to form the first resin layer 2 include, for example, epoxy resin, polyimide resin, bismaleimide triazine resin, polyphenylene ether resin, liquid crystal polymer, polyether ether ketone resin, poly Ether imide resin, polyether sulfonate resin, etc.

[0028] The first ...

no. 2 approach

[0094] Next, a second embodiment of the present invention will be described. Figure 4 It is a sectional view for explaining the manufacturing method of the printed circuit board of 2nd Embodiment of this invention. It should be noted that the same components as those in the above-mentioned first embodiment are denoted by the same symbols, and description thereof will be omitted.

[0095] In the above-mentioned first embodiment, from the viewpoint of preventing the catalyst 10 adhering to the surface 8a of the protective layer 8 from causing abnormal precipitation of the metal plating, the protective layer 8 is peeled off using a stripping solution, and the catalyst 10 adhering to the protective layer 8 is also removed. 8 on the surface of the catalyst 10 to remove, as image 3 (b) shown.

[0096] However, it is conceivable that the following cases may exist in this protective layer peeling process, such as Figure 4 As shown in (a), the protective layer 8 has not been comp...

Embodiment 1

[0125] A second resin layer (thickness: 40 μm) formed of epoxy resin (manufactured by Ajinomoto Fine-Techno Co. Inc., trade name: ABF-GX13) was prepared, and polyimide resin (thickness: 2 μm) was coated on the second resin layer (thickness: 2 μm). on the second resin layer. Thereafter, a protective layer made of polyimide resin is formed on the second resin layer by heat-treating the polyimide resin.

[0126] Next, using a laser processing machine (manufactured by Hitachi Via Mechanics, Ltd., trade name: LC-L), a via hole was formed in the protective layer formed on the second resin layer, and a width of 20 μm was formed in the second resin layer through the via hole. , A channel with a depth of 20 μm.

[0127] Next, using divalent palladium ions (Pd 2+ ) catalyst liquid (made by Shangmura Industrial Co., Ltd., trade name: THRU-CUP AT-105), the second resin layer with the protective layer formed was immersed in the catalyst liquid for 8 minutes at a temperature of 30° C., L...

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Abstract

A production method for a printed wiring board, comprising: a step in which a second resin layer (4) covering a conductor circuit (3) is formed upon a first resin layer (2); a step in which a water-repellent protective layer (8) is formed upon the surface (4a) of the second resin layer (4); a step in which a via hole (5) and a trench (6) are formed on the second resin layer (4), via a though hole (9) in the protective layer (8); a step in which a catalyst (10) is added to the second resin layer (4) and the catalyst (10) is adhered to the via hole (5) and the trench (6); a step in which the protective layer (8) formed upon the surface (4a) of the second resin layer (4) is peeled away; and a step in which electroless plating is used to fill plating metal inside the via hole (5) and trench (6) that have the catalyst (10) adhered therein.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board and the printed circuit board. In particular, it relates to a method of manufacturing a printed wiring board capable of preventing plating film from adhering to the surface of the wiring board, thereby preventing abnormal deposition of metal plating, and a printed wiring board manufactured by the manufacturing method. Background technique [0002] With the rapid development of the electronics industry, the requirements for higher density and higher performance of printed circuit boards are getting higher and higher, and the demand is increasing. In particular, along with the miniaturization and thinning of mother circuit boards in the latest digital devices such as mobile phones, notebook computers, and cameras, there is an increasing demand for higher density and finer wiring patterns. The demand for connecting components mounted on printed circuit boards at higher frequencie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K3/18
CPCH05K2203/1173H05K3/182H05K3/421H05K3/107Y10T29/49165H05K1/115H05K3/422
Inventor 竹内雅治山本久光堀田辉幸
Owner C UYEMURA & CO LTD