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Clamping mechanism for handling substrates within a substrate carrier

A substrate carrier and substrate technology, which is applied in semiconductor devices, electrical solid state devices, semiconductor/solid state device manufacturing, etc., can solve problems such as unusable

Active Publication Date: 2018-01-23
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, current board designs cannot be used with substrate carriers with a top carrier above the substrate

Method used

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  • Clamping mechanism for handling substrates within a substrate carrier
  • Clamping mechanism for handling substrates within a substrate carrier
  • Clamping mechanism for handling substrates within a substrate carrier

Examples

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Embodiment Construction

[0021] In this section, we will explain several preferred embodiments of the present invention with reference to the accompanying drawings. Whenever the shapes, relative positions, and other aspects of components described in the embodiments are not clearly defined, the scope of the present invention is not limited to the components shown for illustrative purposes only. Additionally, while numerous details are set forth, it is understood that some embodiments of the invention may be practiced without these details. In other instances, well-known structures and techniques have not been shown in detail in order not to obscure the understanding of this description.

[0022] figure 1 An exploded top perspective view showing the clamping assembly of the substrate carrier. Clamping assembly 100 may include clamping plate 102 configured to clamp one or more of substrates 108 between top carrier plate 104 and bottom carrier plate 106 of substrate carrier 160 . Typically, clamping p...

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Abstract

The present invention provides a method and clamping device for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping device may comprise a substrate carrier having a top plate and a bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on the side of the top plate opposite the bottom plate, the clamping plate having a pair of clamping members and an opening aligned with the cavity, each clamping member of the pair facing toward the side of the opening A center extends through the cavity such that the clamping member presses the portion of the substrate exposed through the opening against the base plate. The method may include providing a clamping plate having an opening configured to align with a cavity formed in the substrate carrier and mounting a pair of resilient arms to the clamping plate.

Description

technical field [0001] One embodiment of the present invention relates to a clamping mechanism for clamping a substrate within a substrate carrier during processing operations, and more particularly to a clamping mechanism for clamping a substrate during an ultrasonic flip chip mounting process. Clamping mechanism that fits tightly within the substrate carrier. Other embodiments are also described and claimed herein. Background technique [0002] Current camera module assembly processing involves processing singulated leadless chip carrier (LCC) substrates. Assembly processing for surface mount technology (SMT), wash and clean, flip chip, underfill, and glass attach becomes challenging due to the near weightless features and tiny size of the substrate. Typically, SMT and glass attach processing are done on one side of the substrate, while flip-chip and underfill are done on the other side, thus requiring a flip-chip approach. Furthermore, the weight and size of the substr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L24/75H01L24/81H01L24/83H01L24/95H01L27/14618H01L2224/73204H01L2224/75343H01L2224/75704H01L2224/7598H01L2224/81206H01L2224/83104H01L2224/95H01L2924/15153Y10T29/49826Y10T29/49998
Inventor G·A·C·阿法布勒H·J·C·托克P·万卡泰萨帕K·P·泰奥A·Q·杨
Owner APPLE INC