Process method for reworking after TP full lamination

A process method and full lamination technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the problems of difficult rework, low rework yield and efficiency

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A process method and full lamination technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the problems of difficult rework, low rework yield and efficiency

CN104960313AInactive Publication Date: 2015-10-07SHENZHEN JINGHUA DISPLAY

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[0016] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] This embodiment provides a TP full lamination post-rework process, which includes the following steps: figure 2 As shown, first, perform step A: Freeze, seal and package the product to be reworked for ultra-low temperature freezing; wherein, put the reworked product into a freezer in an ultra-low temperature container; figure 1 As shown, the reworked product includes a sensor layer 105 , a cover layer 103 , and OCA or LOCA glue 104 for pasting the sensor layer 105 and the cover layer 103 , by putting the reworked product into a container 101 filled with liquid nitrogen 102 .

[0018] First of all, choose a method that can achieve low temperature freezing, and consider the following aspects: economical aspects; harm to the human body; the difficulty of processing and other comprehensive considerations, we finally choose liquid nitrogen freezing to freeze the p...

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Abstract

The invention discloses a process method for reworking after TP full lamination, which comprises the following steps: A: freezing: packaging products needing reworking in a sealed way and carrying out deep-freezing treatment; B: stripping: taking out reworks after freezing treatment, and stripping all components connected with OCA or LOCA in the reworks; C: glue removal: removing residue glue on the surface of each component; D: film lamination: laminating a film for each component for protection. According to the invention, in an ultralow temperature state, the glue performance of LOCA or OCA changes, and the bonding strength of glue becomes tiny or even disappears; according to the principle, the problems of high reworking difficulty and low reworking rate of full-lamination products are overcome; by reworking with the method disclosed by the invention, the yield can reach more than or equal to 80%.

Description

technical field [0001] The invention relates to the technical field of TP module assembly, in particular to a reworking process method for defective products after full lamination of TP. Background technique [0002] With the rapid development of technology, touch screens are becoming more and more popular in people's daily life due to their unique advantages; and among many touch screen structures, full-fit screens have better transmittance and higher The reliable performance of TP is more and more welcomed by the public; however, for TP manufacturing enterprises, it is difficult to rework the defective products in the production process, whether it is the full lamination of LOCA or OCA; the result is that the product production cost High, it is difficult to form an effective competitiveness. [0003] Therefore, there are defects in the prior art and need to be improved. Contents of the invention [0004] The technical problem to be solved by the present invention is: t...

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Application Information

Patent Timeline

07 Oct 2015

Publication

CN104960313A

IPC: B32B38/10; B32B37/08

CPC: B32B38/10; B32B37/08

Inventors: 张军; 鲜小聪