Electronic component

A technology of electronic components and circuit components, applied to electrical components, parts of transformers/inductors, circuits, etc., can solve problems such as fracture and grain boundary cracks

Inactive Publication Date: 2015-10-21
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the inductance element 500, as Figure 9 As shown, for the metal conductor 503 that is straight before firing, cracks occur due to the coarsening of the grain boundaries accompanying the grain growth during firing.
And, if the compressive force of the shrinkage of the ferrite sheet during firing i

Method used

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Experimental program
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Example

[0022] (First embodiment)

[0023] Hereinafter, the electronic component 10A as the first embodiment will be described with reference to the drawings. figure 1 It is an external perspective view of the electronic component 10A as the first embodiment. figure 2 It is an exploded perspective view of the laminated body 12 in the electronic component 10A as the first embodiment. Hereinafter, the stacking direction of the electronic component 10A is defined as the z-axis direction, and the direction along the long side of the electronic component 10A when viewed from the z-axis direction is defined as the x-axis direction. In addition, the direction along the short side of the electronic component 10A when viewed from the z-axis direction is defined as the y-axis direction. It should be noted that the x-axis, y-axis, and z-axis are orthogonal to each other.

[0024] Electronic components 10A such as figure 1 Shown is a rectangular parallelepiped. In addition, the electronic compone...

Example

[0046] (Second embodiment)

[0047] In the electronic component 10B as the second embodiment, the material of the internal conductor 30 is copper, and the surface of the internal conductor 30 is plated with nickel. The other structure is the same as the above-mentioned first embodiment. Therefore, the description of the second embodiment other than the internal conductor 30 is as described in the above-mentioned first embodiment.

[0048] With the electronic component 10B as the second embodiment, it is possible to suppress the DC resistance value after firing from being greater than the DC resistance value before firing. Specifically, in the electronic component 10B, nickel covers the surface of the internal conductor 30. This suppresses the occurrence of cracks in the internal conductor 30 of the electronic component 10B during firing. As a result, the DC resistance value after firing can be suppressed from being greater than the DC resistance value before firing.

[0049] In a...

Example

[0050] (3rd embodiment)

[0051] In the electronic component 10C as the third embodiment, the material of the internal conductor 30 is copper, and the surface of the internal conductor 30 is plated with iron. The other structure is the same as the above-mentioned first embodiment. Therefore, descriptions other than the internal conductor 30 in the third embodiment are as described in the above-mentioned first embodiment.

[0052] With the electronic component 10C as the third embodiment, it is possible to suppress the DC resistance value after firing from being greater than the DC resistance value before firing. Specifically, in the electronic component 10C, iron covers the surface of the internal conductor 30. This suppresses the occurrence of cracks in the internal conductor 30 during the firing of the electronic component 10C. As a result, the DC resistance value after firing can be suppressed from being greater than the DC resistance value before firing.

[0053] In addition,...

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Abstract

The purpose of the present invention is to prevent the direct-current resistance of an electronic component after firing from being increased in comparison to the direct-current resistance of the electronic component before firing, in said electronic component a conductor formed of a wire being built in a ceramic sintered body. An electronic component (10) is provided with a ceramic sintered body (12) and an internal conductor (30). The internal conductor (30) constitutes a circuit element and is formed of a wire which is mainly composed of copper and to which nickel is added.

Description

technical field [0001] The present invention relates to electronic components, and particularly to electronic components in which conductors formed of wire rods are embedded in ceramic sintered bodies. Background technique [0002] An inductance element described in Patent Document 1 is known as a conventional electronic component in which a conductor formed of a wire rod is embedded in a ceramic sintered body. This inductive element 500 as Figure 8 Shown is a sintered body in which a plurality of ferrite sheets 501 are stacked, and a metal conductor 503 is arranged inside. The metal conductor 503 is a rod-shaped member formed of silver, copper, or the like. In addition, terminal electrodes (not shown) are formed on the surface of the inductance element 500 . [0003] However, inductive element 500, as Figure 9 As shown, in the linear metal conductor 503 before firing, cracks occur due to the coarsening of grain boundaries accompanying grain growth during firing. And, ...

Claims

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Application Information

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IPC IPC(8): H01F17/04
CPCH01F17/04H01F27/292H01F1/344H01F27/2804H01F27/245H01F1/22
Inventor 河南亘
Owner MURATA MFG CO LTD
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