Preparation method of trapezoidal pixel bank structure and oled device
A trapezoidal and pixel technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of vertical pixel Bank structure, difficult surface hydrophilic and hydrophobic treatment, poor uniformity of device pixels, and reduced device aperture ratio. Achieve the effect of reducing lateral erosion, avoiding device open circuit, and improving uniformity
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[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0036] combined with Figure 2-7 , the embodiment of the present invention provides a method for preparing a trapezoidal pixel Bank structure, comprising the following steps:
[0037] S01. Provide a TFT backplane, coat a layer of Bank material on the electrodes of the TFT backplane, and bake the Bank material to form a Bank layer with adhesion to the electrodes, wherein the Bank material is positive Bank material;
[0038] In the above step S01, in this embodiment, the TFT backplane includes a TFT array and electrodes sequentially stacked on a hard carrier substr...
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