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Ceramic Electronic Components

A technology of electronic components and ceramics, which is applied in the field of ceramic electronic components, can solve problems such as difficulty in suppressing transfer, and achieve clear characteristics and effects

Active Publication Date: 2018-07-17
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the wrap-in portions 15a and 15b of the external resistance electrodes 5a and 5b have base end side joints 15a1 and 15b1 joined to the main surfaces 11 and 12 of the ceramic element 1, it is difficult to suppress the stress corresponding to the above-mentioned stress from passing through the external terminal electrodes. 5a and 5b pass to ceramic element 1

Method used

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  • Ceramic Electronic Components
  • Ceramic Electronic Components
  • Ceramic Electronic Components

Examples

Experimental program
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Embodiment Construction

[0026] First, quote figure 1 with figure 2 , and an embodiment in which the present invention is applied to a multilayer ceramic capacitor will be described.

[0027] Depend on figure 1 It can be seen that the multilayer ceramic capacitor 10 (hereinafter simply referred to as the capacitor 10 ) has two external electrodes 12 provided on the outer surface of a substantially rectangular parallelepiped ceramic chip 11 .

[0028] The ceramic chip 11 has a length dimension ( figure 1 left-right dimension in)>width dimension ( figure 1 Front and rear direction dimension in) = height dimension ( figure 1 The upper and lower direction dimensions in), or the dimensional relationship of length dimension > width dimension > height dimension, with rounded corners at eight corners. The ceramic chip 11 has a plurality of ( figure 1 16 in the center) internal electrode layers 11b; and protective layers 11c provided so as to cover the internal electrode layers 11b on both sides in the ...

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PUM

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Abstract

In an embodiment of a ceramic electronic component, an external electrode 12 of a capacitor 10 has one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip 11, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chip 11 and also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal film 12a formed on the exterior surface of the ceramic chip 11 and a plated metal film 12b formed on the exterior surface of the baked metal film 12a via an adhesive force mitigation film 12c.

Description

technical field [0001] The present invention relates to a ceramic electronic component using a ceramic chip as a component body. Background technique [0002] For ceramic electronic components using a ceramic chip as the component body, such as capacitors, inductors and registers, generally two or more external electrodes are provided on the outer surface of a roughly rectangular parallelepiped ceramic chip. Each external electrode has: a first planar portion on a face defining a length dimension or a width dimension of the ceramic chip; The continuous at least one second planar portion has a cross-sectional shape along its height direction that is approximately U-shaped or approximately L-shaped. [0003] Such a ceramic electronic component is mounted on the substrate by electrically connecting the second planar portion, which is the main part of each external electrode, to the conductor pad of the substrate with a bonding material such as an adhesive. However, in this mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/252H01G4/232H01G4/30
CPCH01G4/30H01G4/012H01G4/12H01G4/232H01G4/248
Inventor 大塚幸司中村智彰
Owner TAIYO YUDEN KK