Full-automatic surface-mounting machine electrically connected with controller

Abstract

Disclosed in the invention is a full-automatic surface-mounting machine electrically connected with a controller. The machine is used for pasting a specially-shaped element to a substrate; and a connecting sheet enabling the specially-shaped element and the substrate to be in contact tightly is arranged between the specially-shaped element and the substrate. The full-automatic surface-mounting machine comprises a substrate transmitting device, a connecting sheet fetching and delivery device, a specially-shaped element fetching and delivery device, a film tearing device, and an identification and positioning device. The connecting sheet and the specially-shaped element are in contact based on cooperation of the specially-shaped element fetching and delivery device with the connecting sheet fetching and delivery device. The film tearing device tears a protection film of a specially-shaped element to expose a bonding layer of the specially-shaped element; and the part, with the exposed bonding layer, of the specially-shaped element is pasted to the substrate by the bonding layer and the connecting sheet based on cooperation of the specially-shaped element fetching and delivery device with the substrate transmitting device. The identification and positioning device carries out identification and positioning on pasting mounting of the connecting sheet and the specially-shaped element and the pasting mounting of the specially-shaped element and the substrate when the specially-shaped element is pasted to the substrate. The machine has advantages of simple and compact integrated structure, effectively reduced cost, and improved pasting precision.

Description

technical field [0001] The invention relates to electronic mounting equipment, in particular to a fully automatic mounting machine electrically connected with a controller. Background technique [0002] With the rapid development of science and technology, the trend of miniaturization of electronic and electrical equipment is obvious, and electronic parts are also developing towards high-density integration and ultra-fine. Correspondingly, the requirements for placement equipment of electronic components are also increasing. high. Among them, the fully automatic placement machine is controlled by a computer and is a high-precision automation equipment integrating optics, mechanics and electronics. It is mainly composed of a rack, PCB transmission and carrying organization, drive system, positioning and centering system, placement head, and feeder. , optical recognition system, sensor and computer control system, it realizes the rapid and accurate placement of electronic com...

AI Technical Summary

Problems solved by technology

[0003] However, the existing automatic placement machines are complex in structure and high in cost, and the placement accuracy of the placement machines with simple structure and low cost is not high, and the automatic placement machines are generally only suitable for the placement of standard electronic components. When encountering the placement of special-shaped components, such as when mounting special-shaped components on PCB boards, panels and other substrates, under the current circumstances, the placement of special-shaped components can only be done manually, which is slow and efficient. Low

Moreover, during manual operation, because the components are relatively fine, it is difficult to accurately control the placement station, and the placement accuracy cannot be guaranteed. In addition, glue is generally required for bonding and fixing during placement, which often pollutes components due to excessive glue dispensing. Devices, which directly cause the problems of low production efficiency and low product qualification rate

Further, when attaching the special-shaped component to the substrate, the two are simply pasted together, but the close fit of the two cannot be achieved, especially under the existing processing conditions, the size of the special-shaped component and the substrate is more or less At least there will be a certain processing deviation. When the special-shaped components are directly mounted on the substrate, there will often be a problem that the two are not tightly bonded, resulting in poor contact and resulting in insufficient sensitivity of the use of electronic products.

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