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Quad flat no lead (QFN) product polishing machine

A polishing machine and polishing mechanism technology, applied in the polishing machine field, can solve the problems of waste of manpower, human body injury, low efficiency, etc., and achieve the effects of improving production efficiency, good polishing effect and saving manpower

Active Publication Date: 2015-12-16
苏州中搏成机电设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the packaging process of QFN products, due to its design characteristics, it is necessary to paste high-temperature tape on the lead surface to complete the injection molding operation. However, due to the tape application, there will be a large amount of residual glue on the lead surface and heat sink surface of QFN products, which will affect the product. Yield rate during SMT soldering, lead surface oxidation, affect the appearance and heat dissipation performance of the chip, lead surface overflow glue, affect product yield and appearance, and there may be scratches during the film tearing process, affecting product appearance, currently solved The solution to this problem is to remove it manually after soaking and softening with chemical liquid. The manual removal method has the following disadvantages: chemicals are harmful to the human body and affect the health of workers; manual polishing wastes manpower and is inefficient, and manual polishing The effect is not good; after soaking in chemical medicine, rinsing is required, which wastes electricity and water, thereby increasing production costs

Method used

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  • Quad flat no lead (QFN) product polishing machine
  • Quad flat no lead (QFN) product polishing machine
  • Quad flat no lead (QFN) product polishing machine

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0023] Such as figure 1 As shown, the QFN product polishing machine includes a frame 11 and a polishing mechanism 22 arranged on the frame 11 to polish the product. The polishing mechanism 22 includes a polishing wheel 221 and a polishing wheel driving mechanism 222 for driving the polishing wheel 221 to rotate. And the product placement table mechanism 223 for conveying the products to the bottom of the polishing wheel 221 , and the polishing wheel 221 polishes the products placed on the product placement table mechanism 223 .

[0024] Such as Figure 5 As shown, the axial direction of the polishing wheel 221 is parallel to the product placement platform mechanism 223, and the product placement platform mechanism 223 includes a product placement platform 225 and a product placement platform driving mechanism for driving the product placement ...

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Abstract

The invention discloses a quad flat no lead (QFN) product polishing machine capable of realizing automatic polishing, and relates to the field of machining of electronic products. The QFN product polishing machine comprises a machine frame and a polishing mechanism used for polishing products on the machine frame. The polishing mechanism comprises a polishing wheel, a polishing wheel driving mechanism used for driving the polishing wheel to rotate and a product placement platform mechanism used for conveying the products to the position under the polishing wheel. The residual glue on the surfaces of the QFN products is removed in a polishing mode, the QFN products are automatically cleaned dried in a blowing mode after being polished, the polishing effect is good, and the efficiency is high. Automatic production is realized, labor is saved, and meanwhile production efficiency is improved.

Description

technical field [0001] The invention relates to the field of electronic product processing, in particular to a polishing machine for polishing QFN product pins. Background technique [0002] During the packaging process of QFN products, due to its design characteristics, it is necessary to paste high-temperature tape on the lead surface to complete the injection molding operation. However, due to the tape application, there will be a large amount of residual glue on the lead surface and heat sink surface of QFN products, which will affect the product. Yield rate during SMT soldering, lead surface oxidation, affect the appearance and heat dissipation performance of the chip, lead surface overflow glue, affect product yield and appearance, and there may be scratches during the film tearing process, affecting product appearance, currently solved The solution to this problem is to remove it manually after soaking and softening with chemical liquid. The manual removal method has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/033B24B29/02
CPCB24B27/033B24B29/02
Inventor 陆洪飞吕洪光张俊洋魏晓
Owner 苏州中搏成机电设备有限公司
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