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Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

A technology for polishing surfaces, polishing pads, applied in the direction of grinding tools, etc.

Active Publication Date: 2016-01-06
CMC MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, additional improvements are needed in the evolution of CMP pad technology

Method used

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  • Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
  • Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
  • Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

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Embodiment Construction

[0036] Polishing pads having a polishing surface with continuous protrusions with tapered sidewalls are described herein. In the following description, numerous specific details are set forth, such as specific polishing pad designs and compositions, in order to provide a thorough understanding of embodiments of the invention. It will be apparent to those skilled in the art that embodiments of the invention may be practiced without these specific details. In other instances, well-known processing techniques, such as those associated with combining a slurry with a polishing pad to perform chemical mechanical polishing (CMP) of a semiconductor substrate, are not described in detail so as not to unnecessarily obscure embodiments of the present invention. understand. Furthermore, it should be understood that the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

[0037] Polishing pads used to polish substrates in CMP...

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Abstract

Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.

Description

technical field [0001] Embodiments of the present invention are in the field of chemical mechanical polishing (CMP), particularly polishing pads having a polishing surface with continuous protrusions with tapered sidewalls. Background technique [0002] Chemical-mechanical planarization or chemical-mechanical polishing (often abbreviated as CMP) is a technique used in semiconductor fabrication to planarize semiconductor wafers or other substrates. [0003] The process involves the use of abrasive and aggressive chemical slurries (commonly referred to as gums) in combination with polishing pads and retaining rings that are typically larger in diameter than the wafer. The polishing pad and wafer are forced together by the dynamic polishing head and held in place by plastic retaining rings. Dynamic polishing head rotation during polishing. This method facilitates the removal of material and tends to smooth out any irregularities, thereby making the wafer straight or planar. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/26
CPCB24B37/26
Inventor P·A·勒菲弗W·C·阿里森A·W·辛普森D·斯科特P·黄L·M·查尔恩斯J·R·莱因哈特R·科普里希
Owner CMC MATERIALS INC