Water-cooling heat dissipation seat used for computer processor

A computer processor, water-cooled heat dissipation technology, applied in the direction of computing, electrical digital data processing, digital data processing components, etc., can solve the problems of poor heat dissipation efficiency, insufficient heat exchange between the cooling liquid and the bottom plate, etc., to achieve good heat dissipation effect, Good heat transfer and exchange effect, promote heat absorption effect

Inactive Publication Date: 2016-01-27
刘昕
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The water-cooled heat sink in the prior art includes a base plate and an upper cover assembly, the base plate is provided with a coolant flow groove, the upper cover assembly is provided with a coolant inlet and a coolant outlet, and the coolant inlet and the coolant outlet are connect

Method used

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  • Water-cooling heat dissipation seat used for computer processor
  • Water-cooling heat dissipation seat used for computer processor

Examples

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Embodiment Construction

[0014] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0015] like figure 1 and figure 2 As shown, the present embodiment is used for the water-cooled heat sink of computer processor and comprises copper base plate 1 and upper cover assembly 2, is provided with coolant flow groove 11 on copper base plate 1, is provided with coolant inlet 201 and cooling liquid on upper cover assembly 2 The liquid outlet 202, the cooling liquid inlet 201 and the cooling liquid outlet 202 communicate with the cooling liquid flow groove 11 respectively, the cooling liquid inlet 201 is located in the middle of the upper cover assembly 2, the cooling liquid outlet 202 is located at the edge of the upper cover assembly 2,...

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Abstract

The present invention discloses a water-cooling heat dissipation seat used for a computer processor. The water-cooling heat dissipation seat comprises a copper baseplate (1) and an upper cover assembly (2). A coolant flowing groove (11) is formed in the copper baseplate (1); a coolant inlet (201) and a coolant outlet (202) are arranged on the upper cover assembly (2); the coolant inlet (201) and the coolant outlet (202) communicate with the coolant flowing groove (11); the coolant inlet (201) is located at the middle part of the upper cover assembly (2); the coolant outlet (202) is located at an edge of the upper cover assembly (2); copper pillar rods (12) are uniformly arranged in the coolant flowing groove (11) of the copper baseplate (1) in the vertical direction. The water-cooling heat dissipation seat used for the computer processor disclosed by the present invention has the advantages of good heat dissipation effects, high heat dissipation speed, high heat dissipation efficiency and simple structure.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of computer processors, in particular to a water-cooled heat sink for computer processors. Background technique [0002] Due to its high operating frequency and heavy computing load, the processor of a computer has always been the main heat-generating component of computer equipment. Computer processor heat dissipation generally includes three forms: air cooling, heat pipe and water cooling. Among them, water cooling technology has been widely used in high-end processors with high heat dissipation due to its high heat dissipation efficiency and low noise. The water-cooled heat sink in the prior art includes a base plate and an upper cover assembly, the base plate is provided with a coolant flow groove, the upper cover assembly is provided with a coolant inlet and a coolant outlet, and the coolant inlet and the coolant outlet are connected to the coolant flow groove respectively. Howeve...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 刘昕
Owner 刘昕
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