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Ball grid array (BGA) molding mold

A mold and molding technology, applied in the field of BGA molding molds, can solve the problems of high cost, wrong assembly, high processing requirements for eccentric positioning pins, etc., and achieve the effect of maintaining stable position

Active Publication Date: 2016-02-17
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art adopts the positioning method of eccentric pins (specifically refer to the technical document of a BGA molding mold whose application publication number is CN104552672A), although in the positioning of the BGA molding mold, the needle tip width of the existing eccentric positioning pins can be based on The installation pin hole of the positioning pin is changed and processed, but the existing problem is that every time the positioning pin is replaced, the mold needs to be disassembled and reassembled, which is time-consuming and there are other problems caused by incorrect assembly, etc. In addition, the processing requirements of the eccentric positioning pin are high. ,high cost

Method used

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  • Ball grid array (BGA) molding mold
  • Ball grid array (BGA) molding mold
  • Ball grid array (BGA) molding mold

Examples

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Embodiment Construction

[0038] combine figure 1 , figure 2 , a BGA molding die, comprising a mold base 20, a plurality of barrels 30 are evenly arranged longitudinally in the middle of the mold base, mold boxes 40 are arranged on the left and right sides of the barrel, and the mold boxes include longitudinally arranged inner frames Bar 41, the outer frame bar 42 that is arranged vertically, the first frame bar 43 that is set horizontally, the second frame bar 44 that is set horizontally, described inner frame bar is positioned at the side of barrel, described inner frame bar, outer frame bar , the first frame bar and the second frame bar form a rectangular general cavity, and the total cavity is provided with a plurality of longitudinally evenly arranged cavity bars 45, and a plurality of longitudinally evenly arranged cavity bars divide the total cavity Divided into a plurality of cavities 401 .

[0039] combine figure 2 , Figure 4 , an installation cavity is provided in the outer frame bar, ...

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PUM

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Abstract

The invention discloses a ball grid array (BGA) molding mold. The BGA molding mold comprises a mold seat. A plurality of charging barrels are longitudinally and evenly distributed in the middle of the mold seat. Mold boxes are arranged on the left and right sides of the charging barrels and comprise a plurality of cavities. Longitudinal position adjustment devices are installed in an outer frame strip of each cavity. Each longitudinal position adjustment device comprises a movable part and a fixed part. One end of each cavity strip is in sliding fit with a frame strip of the corresponding cavity. Each movable part is fixedly connected with the end of the corresponding cavity strip. Through the technical scheme, the longitudinal position adjustment devices are buried in the outer frame strips and can adjust the positions of the cavity strips in order to meet packaging of various BGAs in slight changing sizes.

Description

Technical field: [0001] The invention relates to the technical field of semiconductor packaging, in particular to a BGA molding die. Background technique: [0002] In the MOLDING process of semiconductor packaging, due to the particularity of the substrate material, the control accuracy of some of the substrates of different manufacturers and types cannot meet the packaging requirements. The substrate is actually a PCB board, and many dimensions can only be about ±0.1mm. In the MOLDING process, because the smallest particle of the material epoxy resin is smaller than this size, there is a problem of overflow of the molding compound, and the equipment cannot work automatically. [0003] The current measures are to compensate and control the size of different batches of substrates by replacing the eccentric positioning pins, so as to ensure that the gap is smaller than the smallest particle of epoxy resin, and the equipment can work automatically. The prior art adopts the po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/12H01L21/56H01L21/58
Inventor 王荣沈祺舜
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD