Sound-absorbing material for buildings

Abstract

A sound-absorbing material for buildings comprises the components in parts by mass: 15-20 parts of high-density polyethylene, 10-15 parts of hollow glass micro-beads, 4-7 parts of diatomite, 2-6 parts of silicon carbide, 3-9 parts of zirconium dioxide, 3-7 parts of a wetting agent, 6-10 parts of a mica powder, 6-12 parts of organic silicon modified epoxy resin, 3-8 parts of a mixed solvent, 6-10 parts of xylosma racemosum wood chips, and 5-10 parts of attapulgite. By the technical scheme, the sound-absorbing material for the buildings can absorb most of noise in an environment, has a good effect on bass, and besides, has a certain mouldproof function.

Description

technical field [0001] The invention belongs to the field of building materials, in particular to a sound-absorbing material for building. Background technique [0002] Noise prevents people from resting, studying and working normally, and also interferes with the sounds people want to hear. Noise can damage the sensory hair cells of the ear's sound-sensing organ (the cochlea). Once the sensory hair cells are damaged, they can never be restored. Sensory hair cells with high frequency are most vulnerable to noise damage. In the field of construction, noise is also a great hazard. In building houses, noise reduction treatment is also required to improve people's comfort. Sound-absorbing building materials are people's first choice. Therefore, it is of practical significance to develop a new type of sound-absorbing material. Contents of the invention [0003] The purpose of the present invention is to propose a new type of sound-absorbing material for construction. The tec...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a new type of sound-absorbing material for construction. The technical problem to be solved is to make it able to absorb the noise in the environment well and reduce the noise hazard, so that it is more suitable for practical use.